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WL1801MODGBMOCR

Texas Instruments

WL1801MODGBMOCR by Texas Instruments

WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.

Median Price

$9.943

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,305 parts In-Stock

1+ parts

$9.943

100+ parts

$8.686

1k+ parts

$5.990

10k+ parts

-

17,305

$9.943

$8.686

$5.990

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$5.990

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$5.990

-

-

-

Digiode

USA . 117 parts In-Stock

1+ parts

$9.446

100+ parts

-

1k+ parts

-

10k+ parts

-

117

$9.446

-

-

-

Bristol Electronics

USA . 52,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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52,800

-

-

-

-

Vyrian

USA . 6,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,237

-

-

-

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Chip Stock

USA . 4,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,840

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-

-

-

Cyclops Electronics Ltd

UK . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,879 parts In-Stock

1+ parts

$5.990

100+ parts

-

1k+ parts

-

10k+ parts

$5.870

2,879

$5.990

-

-

$5.870

Ampacity Inc.

Singapore . 16,992 parts In-Stock

1+ parts

$8.450

100+ parts

-

1k+ parts

-

10k+ parts

-

16,992

$8.450

-

-

-

Semicontronic

India . 16,840 parts In-Stock

1+ parts

$8.450

100+ parts

$8.239

1k+ parts

$8.196

10k+ parts

-

16,840

$8.450

$8.239

$8.196

-

Corphita

USA . 2,009 parts In-Stock

1+ parts

$8.949

100+ parts

-

1k+ parts

-

10k+ parts

-

2,009

$8.949

-

-

-

Advanced Electronics

New Zealand . 4,811 parts In-Stock

1+ parts

$9.051

100+ parts

$8.598

1k+ parts

$8.598

10k+ parts

-

4,811

$9.051

$8.598

$8.598

-

Parana Technologies

USA . 2,298 parts In-Stock

1+ parts

$9.809

100+ parts

-

1k+ parts

$10.379

10k+ parts

-

2,298

$9.809

-

$10.379

-

ChromeModa Solutions

Germany . 5,321 parts In-Stock

1+ parts

$11.021

100+ parts

$9.037

1k+ parts

-

10k+ parts

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5,321

$11.021

$9.037

-

-

IDEA Electronic Components Group

UK . 1,340 parts In-Stock

1+ parts

$11.021

100+ parts

$10.470

1k+ parts

$9.919

10k+ parts

-

1,340

$11.021

$10.470

$9.919

-

Corohmni

South Africa . 84 parts In-Stock

1+ parts

$14.180

100+ parts

-

1k+ parts

-

10k+ parts

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84

$14.180

-

-

-

AZTECH Wire

Italy . 434 parts In-Stock

1+ parts

$16.200

100+ parts

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434

$16.200

-

-

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XScomponents

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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20,000

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-

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A-Z Elektronik GmbH

Germany . 7,436 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,436

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-

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Lixinc

USA . 2,976 parts In-Stock

1+ parts

-

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2,976

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-

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Argo Parts USA

USA . 1,877 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,877

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-

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GreenTree Electronics

Israel . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,200

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-

-

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DigiPath Technology Company

USA . 559 parts In-Stock

1+ parts

-

100+ parts

$9.937

1k+ parts

-

10k+ parts

-

559

-

$9.937

-

-

Overview

Discover the cutting-edge WL1801MODGBMOCR by Texas Instruments, a top-quality telecom interface IC that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is sure to exceed your expectations. Ideal for a variety of applications, this IC provides seamless connectivity and high-speed data transfer, making it an essential component for any telecom project. Experience the value and benefits of this innovative product today and unlock a world of possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during manufacturing.

Power Supplies (V): 2.9/4.8

Provides flexibility in power options, making it adaptable to different voltage requirements.

No. of Terminals: 100

Offers a high level of connectivity for various functions and interfaces.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high temperature environments.

Minimum Operating Temperature: -20 °C

Ensures functionality even in low temperature conditions, increasing the product's versatility.

Data Rate: 100 Mbps

Supports high-speed data transfer, making it suitable for telecom applications requiring fast communication.

Technical Specifications

Other Function Telecom Interface ICs WL1801MODGBMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

R-PBGA-B100

JESD-609 Code:

e4

Length:

13.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA100(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.9/4.8

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13.3 mm

Trade Compliance

WL1801MODGBMOCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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