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WL1805MODGBMOC

Texas Instruments

WL1805MODGBMOC by Texas Instruments

Texas Instruments' WL1805MODGBMOC is a telecom IC with 130 terminals in a rectangular grid array package. Operating temperature ranges from -20 to 70°C, with a nominal voltage of 3.7V. This IC is ideal for telecom circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,455 parts In-Stock

1+ parts

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3,455

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Digiode

USA . 659 parts In-Stock

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659

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 139 parts In-Stock

1+ parts

$6.190

100+ parts

-

1k+ parts

$6.955

10k+ parts

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139

$6.190

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$6.955

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DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

$6.816

100+ parts

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130

$6.816

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ChromeModa Solutions

Germany . 6,910 parts In-Stock

1+ parts

$6.955

100+ parts

$5.703

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6,910

$6.955

$5.703

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IDEA Electronic Components Group

UK . 1,351 parts In-Stock

1+ parts

$6.955

100+ parts

-

1k+ parts

$6.260

10k+ parts

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1,351

$6.955

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$6.260

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AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$16.406

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384

$16.406

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One Stop Electronics

USA . 1,166 parts In-Stock

1+ parts

$983.000

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1,166

$983.000

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Lixinc

USA . 1,927 parts In-Stock

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1,927

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Corphita

USA . 1,533 parts In-Stock

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1,533

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A-Z Elektronik GmbH

Germany . 170 parts In-Stock

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170

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Overview

Enhance your telecom projects with the WL1805MODGBMOC by Texas Instruments. Crafted with precision and expertise, this high-quality Telecom Interface IC delivers unparalleled performance and reliability. Whether you're looking to upgrade your communication systems or develop cutting-edge technology, this product offers unmatched value and benefits. Say goodbye to connectivity issues and hello to seamless operation with the WL1805MODGBMOC. Unlock new possibilities and take your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside the package, increasing the longevity of the product.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 130

The high number of terminals allows for a greater connectivity range, enabling more versatile applications for the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can function reliably in a variety of environments without risk of overheating.

Nominal Supply Voltage: 3.7 V

The 3.7V supply voltage is suitable for many electronic devices, providing a stable power source for the product to operate efficiently.

Technical Specifications

Other Function Telecom Interface ICs WL1805MODGBMOC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

WL1805MODGBMOC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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