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WL1805MODGBMOCR

Texas Instruments

WL1805MODGBMOCR by Texas Instruments

Texas Instruments' WL1805MODGBMOCR is a Telecom Interface IC with 100 terminals in a grid array package. Operating at -20 to 70°C, it supports data rates up to 100 Mbps at 3.7V supply voltage. Ideal for telecom circuits, this surface-mount IC has a compact rectangular shape and nickel palladium gold finish.

Median Price

$12.972

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 550 parts In-Stock

1+ parts

$11.850

100+ parts

$11.610

1k+ parts

$11.380

10k+ parts

-

550

$11.850

$11.610

$11.380

-

Texas Instruments

USA . 1,030 parts In-Stock

1+ parts

$14.093

100+ parts

$12.311

1k+ parts

$8.490

10k+ parts

-

1,030

$14.093

$12.311

$8.490

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,601 parts In-Stock

1+ parts

$13.388

100+ parts

-

1k+ parts

-

10k+ parts

-

2,601

$13.388

-

-

-

Vyrian

USA . 3,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$11.910

100+ parts

-

1k+ parts

-

10k+ parts

-

218

$11.910

-

-

-

Corphita

USA . 4,672 parts In-Stock

1+ parts

$12.684

100+ parts

-

1k+ parts

-

10k+ parts

-

4,672

$12.684

-

-

-

Parana Technologies

USA . 1,791 parts In-Stock

1+ parts

$15.580

100+ parts

-

1k+ parts

$15.956

10k+ parts

-

1,791

$15.580

-

$15.956

-

DigiPath Technology Company

USA . 508 parts In-Stock

1+ parts

$17.156

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$17.156

-

-

-

ChromeModa Solutions

Germany . 4,181 parts In-Stock

1+ parts

$17.506

100+ parts

$14.355

1k+ parts

-

10k+ parts

-

4,181

$17.506

$14.355

-

-

IDEA Electronic Components Group

UK . 548 parts In-Stock

1+ parts

$17.506

100+ parts

$16.631

1k+ parts

$15.755

10k+ parts

-

548

$17.506

$16.631

$15.755

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Infinite Electronics LLP (Excess)

. 1,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

-

-

-

-

Formix International (Excess)

India . 1,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,418

-

-

-

-

Overview

Upgrade your telecom interface systems with the high-quality WL1805MODGBMOCR by Texas Instruments. This cutting-edge product offers unmatched reliability and performance, thanks to the superior manufacturing standards of Texas Instruments. Perfect for a wide range of applications in the telecommunications industry, this product provides exceptional value and benefits to customers looking for seamless connectivity and efficient data transfer. Trust Texas Instruments to deliver top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making this product suitable for long-term use in various environments.

Surface Mount: YES

Being surface mountable, this product is easy to install on PCBs, saving space and allowing for efficient production processes.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures compatibility with standard PCB layouts and facilitates easy integration into existing systems.

Power Supplies (V): 2.9/4.8

The wide range of power supply options allows flexibility in voltage requirements, making this product versatile for different applications.

No. of Terminals: 100

Having a high number of terminals enables connectivity with various components, enhancing the functionality and potential applications of this product.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient routing of signals and enhances signal integrity, ensuring reliable performance in telecom applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand heat fluctuations and maintain stable performance in demanding environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliable operation even in cold conditions, making this product suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and maintenance, making this product convenient to work with during assembly and troubleshooting.

Maximum Seated Height: 2 mm

The low maximum seated height helps reduce overall profile and space requirements, making this product suitable for compact telecom devices and systems.

Width: 13.3 mm

With a standard width, this product can fit into common PCB layouts and enclosures, ensuring compatibility and ease of integration in telecom applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature reduces the risk of component damage during soldering, ensuring reliable assembly and product quality.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand high-temperature soldering processes without compromising its electrical and mechanical properties.

Length: 13.4 mm

The standard length of the product allows for easy placement and alignment on PCBs, ensuring proper connectivity and functionality in telecom systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance within standard operating temperature ranges, making this product suitable for commercial telecom applications.

Terminal Form: BUTT

The butt terminal form provides reliable connectivity and mechanical strength, ensuring secure connections and long-term durability in telecom circuit applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and functionality for telecom applications, ensuring reliable operation in communication systems.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7V offers compatibility with standard power sources, ensuring easy integration and reliable performance in various telecom devices.

Terminal Pitch: 0.7 mm

The small terminal pitch allows for high-density mounting on PCBs, maximizing board space efficiency and enabling compact design solutions in telecom interfaces.

Data Rate: 100 Mbps

With a data rate of 100 Mbps, this product offers high-speed connectivity and data transfer capabilities, making it suitable for telecom devices that require fast data processing.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product is resistant to moisture-related damage during storage and handling, ensuring long-term reliability in various environments.

Technical Specifications

Other Function Telecom Interface ICs WL1805MODGBMOCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

R-PBGA-B100

JESD-609 Code:

e4

Length:

13.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA100(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.9/4.8

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.7 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13.3 mm

Trade Compliance

WL1805MODGBMOCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8473.30.11.80

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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