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WL1801GYFVR

Texas Instruments

WL1801GYFVR by Texas Instruments

Texas Instruments' WL1801GYFVR is a telecom IC with 130 terminals in a grid array package. It operates b/w -40 to 105°C, with peak reflow temperature of 260°C. Suitable for industrial applications requiring thin profile and fine pitch design.

Median Price

$7.496

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,500 parts In-Stock

1+ parts

$5.152

100+ parts

$4.200

1k+ parts

$2.800

10k+ parts

-

44,500

$5.152

$4.200

$2.800

-

Mouser Electronics

USA . 2,097 parts In-Stock

1+ parts

$9.840

100+ parts

$6.300

1k+ parts

$4.830

10k+ parts

$4.690

2,097

$9.840

$6.300

$4.830

$4.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.500

100+ parts

-

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-

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300

$3.500

-

-

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Digiode

USA . 4,253 parts In-Stock

1+ parts

$4.894

100+ parts

-

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4,253

$4.894

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Vyrian

USA . 23,178 parts In-Stock

1+ parts

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23,178

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Chip Stock

USA . 23,023 parts In-Stock

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23,023

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Contempo Components LLC

USA . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 23,162 parts In-Stock

1+ parts

$3.060

100+ parts

-

1k+ parts

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23,162

$3.060

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Corphita

USA . 2,397 parts In-Stock

1+ parts

$4.637

100+ parts

-

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2,397

$4.637

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-

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Parana Technologies

USA . 1,305 parts In-Stock

1+ parts

$10.808

100+ parts

-

1k+ parts

$11.287

10k+ parts

-

1,305

$10.808

-

$11.287

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DigiPath Technology Company

USA . 735 parts In-Stock

1+ parts

$11.901

100+ parts

$10.949

1k+ parts

-

10k+ parts

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735

$11.901

$10.949

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ChromeModa Solutions

Germany . 6,129 parts In-Stock

1+ parts

$12.144

100+ parts

$9.958

1k+ parts

-

10k+ parts

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6,129

$12.144

$9.958

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$12.144

100+ parts

$11.537

1k+ parts

$10.930

10k+ parts

-

1,722

$12.144

$11.537

$10.930

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Lixinc

USA . 19,061 parts In-Stock

1+ parts

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19,061

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 1,231 parts In-Stock

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1,231

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Overview

Unlock the power of seamless communication with the top-of-the-line WL1801GYFVR by Texas Instruments. Manufactured by a renowned industry leader, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value, benefits, and advantages. Experience enhanced performance and efficiency with this innovative solution that is sure to meet all your communication needs. Elevate your projects to the next level with the WL1801GYFVR from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit board layouts and designs.

No. of Terminals: 130

Offers a wide range of connectivity options and flexibility in application use.

Maximum Operating Temperature: 105 °C

Ensures stable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Provides a wide operating temperature range, making the IC versatile for use in various conditions.

Terminal Finish: TIN SILVER COPPER

Enhances conductivity and prevents corrosion, ensuring a reliable and long-lasting connection.

Terminal Position: BOTTOM

Facilitates easy and secure connection to the circuit board, improving overall reliability.

Width: 4.64 mm

Compact size allows for space-efficient designs and integration into smaller electronic devices.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering processes, ensuring secure and durable connections.

Technical Specifications

Other Function Telecom Interface ICs WL1801GYFVR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

JESD-609 Code:

e1

Length:

4.93 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA130,11X12,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.575 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.64 mm

Trade Compliance

WL1801GYFVR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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