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TDK5100FHTMA1

Infineon Technologies

TDK5100FHTMA1 by Infineon Technologies

Infineon's TDK5100FHTMA1 is a telecom IC with 10 terminals, operating from -40 to 125°C. Its small outline package is surface-mountable and has a matte tin finish. Ideal for automotive applications, this IC operates at 3V and features a square shape with a 3x3mm footprint.

Median Price

$0.978

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$0.478

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$0.478

-

-

-

Arrow

USA . 3,944 parts In-Stock

1+ parts

$0.978

100+ parts

$0.920

1k+ parts

$0.877

10k+ parts

$0.848

3,944

$0.978

$0.920

$0.877

$0.848

Farnell

UK . 1,021 parts In-Stock

1+ parts

$2.870

100+ parts

$1.870

1k+ parts

$1.540

10k+ parts

-

1,021

$2.870

$1.870

$1.540

-

Adafruit Industries

USA . 1,200 parts In-Stock

1+ parts

$9.025

100+ parts

$8.934

1k+ parts

-

10k+ parts

-

1,200

$9.025

$8.934

-

-

Verical

USA . 3,944 parts In-Stock

1+ parts

-

100+ parts

$0.920

1k+ parts

$0.877

10k+ parts

$0.848

3,944

-

$0.920

$0.877

$0.848

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 463 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$0.454

-

-

-

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$1.592

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$1.592

-

-

-

Vyrian

USA . 8,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,700

-

-

-

-

Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,720 parts In-Stock

1+ parts

$0.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

$0.406

-

-

-

Semicontronic

India . 1,478 parts In-Stock

1+ parts

$0.406

100+ parts

$0.396

1k+ parts

$0.394

10k+ parts

-

1,478

$0.406

$0.396

$0.394

-

Corphita

USA . 85 parts In-Stock

1+ parts

$0.430

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$0.430

-

-

-

Argo Parts USA

USA . 896 parts In-Stock

1+ parts

$1.592

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$1.592

-

-

-

Continental Prestige Electronics

USA . 5,023 parts In-Stock

1+ parts

$3.090

100+ parts

$2.900

1k+ parts

$2.720

10k+ parts

-

5,023

$3.090

$2.900

$2.720

-

Aztec Data Supply Inc.

USA . 130 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$6.830

-

-

-

Advanced Electronics

New Zealand . 1,200 parts In-Stock

1+ parts

$9.025

100+ parts

$8.934

1k+ parts

$8.573

10k+ parts

-

1,200

$9.025

$8.934

$8.573

-

Modulus Dynamics

Lithuania . 3,171 parts In-Stock

1+ parts

$13.084

100+ parts

$12.561

1k+ parts

$12.037

10k+ parts

-

3,171

$13.084

$12.561

$12.037

-

AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$13.130

100+ parts

-

1k+ parts

-

10k+ parts

-

745

$13.130

-

-

-

Corohmni

South Africa . 107 parts In-Stock

1+ parts

$16.438

100+ parts

-

1k+ parts

-

10k+ parts

-

107

$16.438

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.512

10k+ parts

$1.481

100

-

$1.560

$1.512

$1.481

Overview

Upgrade your telecom systems with the TDK5100FHTMA1 by Infineon Technologies. With a reputation for excellence in manufacturing, Infineon delivers top-quality products that are sure to meet your needs. This Telecom Interface IC is versatile and reliable, making it ideal for a wide range of applications. Experience the value and benefits of this innovative product, from its small outline design to its automotive-grade temperature capabilities. Trust in Infineon to provide you with the solutions you need for seamless communication.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this product suitable for long-term use in various applications.

Surface Mount: YES

Being surface mountable, this product offers easy installation and space-saving benefits, making it ideal for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can handle demanding operational conditions, ensuring stable performance even in harsh environments.

Nominal Supply Voltage: 3 V

The low nominal supply voltage requirement makes this product energy-efficient and helps in reducing power consumption, suitable for battery-powered devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent requirements for reliability and performance in automotive environments, ensuring compatibility and safety in vehicles.

Technical Specifications

Other Function Telecom Interface ICs TDK5100FHTMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDK5100FHTMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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