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TDK5110XUMA1

Infineon Technologies

TDK5110XUMA1 by Infineon Technologies

Infineon's TDK5110XUMA1 is a telecom IC with 16 terminals, operating from -40 to 125°C. It has a small outline package, 0.65mm terminal pitch, and Gull Wing terminals. Ideal for automotive applications requiring a 3V supply voltage in a compact design.

Median Price

$0.643

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

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$0.643

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Vyrian

USA . 5,617 parts In-Stock

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Chip Stock

USA . 3,040 parts In-Stock

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3,040

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Digiode

USA . 419 parts In-Stock

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419

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,629 parts In-Stock

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$0.643

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$0.630

5,629

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$0.630

Netroflash

USA . 500 parts In-Stock

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$0.643

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$0.630

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500

$0.643

$0.630

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Argo Parts USA

USA . 237 parts In-Stock

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$0.643

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$0.624

237

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$0.624

Modulus Dynamics

Lithuania . 3,962 parts In-Stock

1+ parts

$9.950

100+ parts

$9.552

1k+ parts

$9.154

10k+ parts

-

3,962

$9.950

$9.552

$9.154

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AZTECH Wire

Italy . 622 parts In-Stock

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$14.391

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622

$14.391

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$14.553

100+ parts

$13.243

1k+ parts

$11.933

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450

$14.553

$13.243

$11.933

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Ampacity Inc.

Singapore . 527 parts In-Stock

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$43.000

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527

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 5,078 parts In-Stock

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Corphita

USA . 122 parts In-Stock

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Overview

Upgrade your telecom interfaces with the TDK5110XUMA1 by Infineon Technologies. Crafted with precision and quality, this small outline, thin profile IC offers advanced functionality for a wide range of applications. From automotive to industrial settings, this telecom circuit ensures reliable performance in extreme temperatures, with a gull wing terminal form for easy installation. Trust in the expertise of Infineon Technologies to provide cutting-edge solutions that deliver value and efficiency to your projects. Experience the difference with the TDK5110XUMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides durability and reliability, ensuring the product can withstand various operating conditions.

Surface Mount: YES

Surface mount capability makes installation and integration of the product into electronic devices easier and more efficient.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on circuit boards, optimizing overall design and layout.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can perform reliably in a wide range of environments without overheating.

Nominal Supply Voltage: 3 V

3 V nominal supply voltage is commonly used in many telecom applications, ensuring compatibility with existing systems.

Technical Specifications

Other Function Telecom Interface ICs TDK5110XUMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

TDK5110XUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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