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ADV7533BCBZ-RL

Analog Devices

ADV7533BCBZ-RL by Analog Devices

ADV7533BCBZ-RL by Analog Devices is a telecom IC with 49 terminals in a square grid array package. It operates b/w -10 to 85°C, with a peak reflow temperature of 260°C. This CMOS technology IC has a nominal voltage of 1.8V and is suitable for telecom circuit applications.

Median Price

$4.110

Lifecycle Status

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8

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Arrow

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Chip Stock

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Nova Conductors

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A2Z Electronics, Inc.

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Bristol Electronics

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Semicontronic

India . 2 parts In-Stock

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,716 parts In-Stock

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AZTECH Wire

Italy . 571 parts In-Stock

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Parana Technologies

USA . 4,393 parts In-Stock

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IDEA Electronic Components Group

UK . 1,197 parts In-Stock

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Corohmni

South Africa . 386 parts In-Stock

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DigiPath Technology Company

USA . 1,414 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Discover the cutting-edge ADV7533BCBZ-RL by Analog Devices, a top-tier manufacturer renowned for its high-quality telecom interface ICs. This versatile product, designed with surface mount technology and a compact square package shape, boasts 49 terminals in a grid array style for maximum efficiency. With a wide operating temperature range and superior terminal finish, this telecom circuit offers unparalleled reliability and performance. Ideal for a variety of applications, the ADV7533BCBZ-RL delivers exceptional value and benefits to customers seeking seamless communication solutions. Elevate your projects with this innovative technology today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape is efficient in terms of space utilization on the circuit board.

No. of Terminals: 49

The higher number of terminals allows for more connectivity options and functionality within the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V makes the IC suitable for low-power applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and space-saving on the PCB.

Technical Specifications

Other Function Telecom Interface ICs ADV7533BCBZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XBGA-B49

JESD-609 Code:

e1

Length:

3.46 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.66 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.46 mm

Trade Compliance

ADV7533BCBZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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