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ADV7480WBBCZ-RL

Analog Devices

ADV7480WBBCZ-RL by Analog Devices

ADV7480WBBCZ-RL by Analog Devices is a 100-terminal, low-profile GRID ARRAY IC with operating temp range of -40 to 85°C. Ideal for TELECOM CIRCUITS, it features CMOS tech, 1.8V supply voltage, and AEC-Q100 screening level for industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,956 parts In-Stock

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Chip Stock

USA . 3,310 parts In-Stock

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Digiode

USA . 996 parts In-Stock

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996

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VNN

France . 120 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 648 parts In-Stock

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$6.372

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648

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Parana Technologies

USA . 1,886 parts In-Stock

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$15.847

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$14.738

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

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$17.040

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$16.188

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$16.188

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$16.188

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DigiPath Technology Company

USA . 2,662 parts In-Stock

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$26.582

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$25.519

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$25.519

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$25.519

One Stop Electronics

USA . 571 parts In-Stock

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$446.000

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Semicontronic

India . 705 parts In-Stock

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$857.000

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$835.575

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$831.290

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705

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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Lixinc

USA . 7,725 parts In-Stock

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Corphita

USA . 887 parts In-Stock

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Bastille Electronics

Australia . 66 parts In-Stock

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Overview

Upgrade your telecom interface systems with the ADV7480WBBCZ-RL by Analog Devices. Crafted with precision and expertise, this high-quality IC offers unrivaled performance and reliability. Ideal for a wide range of applications, this product provides seamless connectivity and functionality. Discover the value and benefits of integrating this cutting-edge technology into your projects. Trust Analog Devices to deliver superior solutions for all your telecom interface needs. Elevate your systems with the ADV7480WBBCZ-RL today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Package Shape: SQUARE

Optimal shape for efficient use of space on a circuit board.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high-density mounting and space-saving design.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Facilitates easy and secure connection to the circuit board.

Maximum Seated Height: 1.4 mm

Low profile design saves space and allows for compact circuit board layout.

Width: 9 mm

Compact size allows for flexibility in placement on the circuit board.

Length: 9 mm

Compact size allows for flexibility in placement on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial settings with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminals provide reliable connections and ease of soldering.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 1.8 V

Operates efficiently at a low supply voltage, reducing power consumption.

Terminal Pitch: 0.8 mm

Fine pitch terminals allow for high-density mounting and compact design.

Moisture Sensitivity Level (MSL): 3

Suitable for environments with moderate humidity, ensuring reliability in various conditions.

Technical Specifications

Other Function Telecom Interface ICs ADV7480WBBCZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

ADV7480WBBCZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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