Loading...

BQ51003YFPT

Texas Instruments

BQ51003YFPT by Texas Instruments

BQ51003YFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Suitable for telecom circuits, it has a battery supply of 5V and very thin profile at 0.5mm seated height.

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,451 parts In-Stock

1+ parts

$3.023

100+ parts

$2.326

1k+ parts

$1.224

10k+ parts

-

10,451

$3.023

$2.326

$1.224

-

DigiKey

USA . 15,970 parts In-Stock

1+ parts

$3.490

100+ parts

$2.621

1k+ parts

-

10k+ parts

-

15,970

$3.490

$2.621

-

-

Mouser Electronics

USA . 575 parts In-Stock

1+ parts

$3.490

100+ parts

$2.230

1k+ parts

$1.950

10k+ parts

$1.890

575

$3.490

$2.230

$1.950

$1.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.907

-

-

-

Bristol Electronics

USA . 29 parts In-Stock

1+ parts

$2.523

100+ parts

$1.262

1k+ parts

-

10k+ parts

-

29

$2.523

$1.262

-

-

Digiode

USA . 408 parts In-Stock

1+ parts

$2.872

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$2.872

-

-

-

Chip Stock

USA . 40,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

40,660

-

-

-

-

Vyrian

USA . 9,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,192

-

-

-

-

VNN

France . 2,173 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,173

-

-

-

-

Dan-Mar Components

USA . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29

-

-

-

-

Prism Electronics

USA . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,156 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

-

10k+ parts

-

4,156

$0.907

-

-

-

Continental Prestige Electronics

USA . 1,558 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

-

10k+ parts

$0.889

1,558

$0.907

-

-

$0.889

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.907

100+ parts

$0.889

1k+ parts

-

10k+ parts

-

1,000

$0.907

$0.889

-

-

Corohmni

South Africa . 569 parts In-Stock

1+ parts

$0.922

100+ parts

-

1k+ parts

-

10k+ parts

-

569

$0.922

-

-

-

Semicontronic

India . 9,498 parts In-Stock

1+ parts

$2.060

100+ parts

$2.008

1k+ parts

$1.998

10k+ parts

-

9,498

$2.060

$2.008

$1.998

-

Corphita

USA . 2,002 parts In-Stock

1+ parts

$2.721

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

$2.721

-

-

-

Ampacity Inc.

Singapore . 9,299 parts In-Stock

1+ parts

$4.480

100+ parts

-

1k+ parts

-

10k+ parts

-

9,299

$4.480

-

-

-

Parana Technologies

USA . 35 parts In-Stock

1+ parts

$14.183

100+ parts

-

1k+ parts

$14.639

10k+ parts

-

35

$14.183

-

$14.639

-

DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$15.617

100+ parts

-

1k+ parts

-

10k+ parts

-

469

$15.617

-

-

-

ChromeModa Solutions

Germany . 2,202 parts In-Stock

1+ parts

$15.936

100+ parts

$13.068

1k+ parts

-

10k+ parts

-

2,202

$15.936

$13.068

-

-

IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$15.936

100+ parts

$15.139

1k+ parts

$14.342

10k+ parts

-

31

$15.936

$15.139

$14.342

-

Lixinc

USA . 17,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,180

-

-

-

-

Perfect Parts

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

A-Z Elektronik GmbH

Germany . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

Overview

Discover the cutting-edge efficiency and reliability of the BQ51003YFPT by Texas Instruments, a leading manufacturer in the industry. This innovative telecom interface IC boasts a sleek rectangular design with 28 terminals for seamless integration. Experience the superior quality and performance of this product that offers a wide range of applications, providing unparalleled value to customers seeking top-notch solutions. Upgrade your telecom systems with the BQ51003YFPT and enjoy the benefits of advanced technology at its best.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for high-volume production.

Package Shape: RECTANGULAR

Rectangular package shape offers good compatibility with standard PCB layouts and designs.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a very thin profile and fine pitch helps in optimizing PCB space and improving signal integrity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in tough industrial environments.

Battery Supply (V): 5

5V battery supply supports compatibility with common power sources.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers superior conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB mounting and soldering.

Maximum Seated Height: 0.5 mm

Low maximum seated height helps in minimizing overall board thickness for compact designs.

Width: 1.88 mm

Narrow width enables efficient utilization of space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature helps in preventing thermal damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during manufacturing.

Length: 3 mm

Compact length contributes to overall space-saving in the design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robust performance in harsh operating conditions.

Terminal Form: BALL

Ball terminal form offers secure connections and better mechanical strength.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimized performance in communication applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and efficient signal routing on the PCB.

Technical Specifications

Other Function Telecom Interface ICs BQ51003YFPT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Battery Supply (V):

5

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.88 mm

Trade Compliance

BQ51003YFPT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19