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BQ51013RHLT

Texas Instruments

BQ51013RHLT by Texas Instruments

BQ51013RHLT by Texas Instruments is a telecom interface IC with 20 terminals in a rectangular chip carrier package. It operates at a nominal voltage of 5V and has a terminal pitch of 0.5mm. This IC is suitable for applications requiring thin profile, surface mountable components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,989 parts In-Stock

1+ parts

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2,989

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Digiode

USA . 1,420 parts In-Stock

1+ parts

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1,420

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 804 parts In-Stock

1+ parts

$4.969

100+ parts

-

1k+ parts

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804

$4.969

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Parana Technologies

USA . 2,172 parts In-Stock

1+ parts

$15.413

100+ parts

-

1k+ parts

$15.796

10k+ parts

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2,172

$15.413

-

$15.796

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$16.972

100+ parts

$15.614

1k+ parts

-

10k+ parts

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114

$16.972

$15.614

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IDEA Electronic Components Group

UK . 1,443 parts In-Stock

1+ parts

$17.318

100+ parts

$16.452

1k+ parts

$15.586

10k+ parts

-

1,443

$17.318

$16.452

$15.586

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ChromeModa Solutions

Germany . 1,063 parts In-Stock

1+ parts

$17.318

100+ parts

$14.201

1k+ parts

-

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1,063

$17.318

$14.201

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One Stop Electronics

USA . 1,066 parts In-Stock

1+ parts

$447.000

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1,066

$447.000

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Northwest PG Solutions

USA . 1,715 parts In-Stock

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1,715

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Corphita

USA . 1,701 parts In-Stock

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1,701

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Native Components

USA . 611 parts In-Stock

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611

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Overview

Enhance your telecom systems with the BQ51013RHLT from Texas Instruments, a leading manufacturer renowned for quality and innovation. This versatile interface IC offers seamless integration and superior performance in various applications. With its compact chip carrier design and low profile, this product maximizes space efficiency while delivering reliable power management solutions. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your telecom systems with the BQ51013RHLT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor for easy handling and integration into existing designs.

No. of Terminals: 20

The high number of terminals allows for greater connectivity options and functionality within the telecom interface IC.

Terminal Position: QUAD

Quad terminal positioning enables efficient signal routing and minimizes signal interference for improved performance.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes integration with existing systems and power sources straightforward.

Technical Specifications

Other Function Telecom Interface ICs BQ51013RHLT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N20

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Trade Compliance

BQ51013RHLT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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