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BQ51013AYFPT

Texas Instruments

BQ51013AYFPT by Texas Instruments

BQ51013AYFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

Median Price

$4.110

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,429 parts In-Stock

1+ parts

$4.145

100+ parts

$3.632

1k+ parts

$2.052

10k+ parts

-

3,429

$4.145

$3.632

$2.052

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.260

1k+ parts

$2.920

10k+ parts

$2.740

1,000

-

$3.260

$2.920

$2.740

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.290

1k+ parts

-

10k+ parts

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1,000

-

$4.290

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Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$4.075

1k+ parts

$3.862

10k+ parts

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750

-

$4.075

$3.862

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,088 parts In-Stock

1+ parts

$2.708

100+ parts

-

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2,088

$2.708

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$2.820

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-

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600

$2.820

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-

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Vyrian

USA . 5,375 parts In-Stock

1+ parts

-

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5,375

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VNN

France . 3,831 parts In-Stock

1+ parts

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3,831

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DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.960

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1,000

-

$2.960

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Prism Electronics

USA . 238 parts In-Stock

1+ parts

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238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,289 parts In-Stock

1+ parts

$2.420

100+ parts

$2.360

1k+ parts

$2.347

10k+ parts

-

1,289

$2.420

$2.360

$2.347

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$2.420

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1,143

$2.420

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Corphita

USA . 2,441 parts In-Stock

1+ parts

$2.565

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2,441

$2.565

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Continental Prestige Electronics

USA . 5,645 parts In-Stock

1+ parts

$2.820

100+ parts

-

1k+ parts

-

10k+ parts

$2.764

5,645

$2.820

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-

$2.764

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.820

100+ parts

$2.764

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2,000

$2.820

$2.764

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Argo Parts USA

USA . 395 parts In-Stock

1+ parts

$2.820

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395

$2.820

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Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

$10.967

100+ parts

-

1k+ parts

$11.429

10k+ parts

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2,220

$10.967

-

$11.429

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DigiPath Technology Company

USA . 337 parts In-Stock

1+ parts

$12.076

100+ parts

$11.110

1k+ parts

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337

$12.076

$11.110

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ChromeModa Solutions

Germany . 4,975 parts In-Stock

1+ parts

$12.322

100+ parts

$10.104

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-

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4,975

$12.322

$10.104

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IDEA Electronic Components Group

UK . 1,391 parts In-Stock

1+ parts

$12.322

100+ parts

$11.706

1k+ parts

$11.090

10k+ parts

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1,391

$12.322

$11.706

$11.090

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Corohmni

South Africa . 453 parts In-Stock

1+ parts

$15.774

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453

$15.774

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Lixinc

USA . 14,118 parts In-Stock

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14,118

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Kepictronics

USA . 8,690 parts In-Stock

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8,690

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A-Z Elektronik GmbH

Germany . 7,457 parts In-Stock

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7,457

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Alle Elektronik GmbH

Germany . 4,971 parts In-Stock

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4,971

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Perfect Parts

USA . 3,516 parts In-Stock

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3,516

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Overview

Unlock the next level of connectivity with the BQ51013AYFPT by Texas Instruments. Crafted with precision and innovation, this telecom interface IC boasts top-notch quality and reliability that Texas Instruments is renowned for. Perfect for a wide range of applications, this product offers seamless integration and exceptional performance. Experience the value of superior design and efficiency with the BQ51013AYFPT, where every connection counts. Elevate your project with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency, making it suitable for compact telecom devices.

No. of Terminals: 28

With a high number of terminals, this product offers versatile connectivity options for various telecom interfaces.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch design ensures precise and reliable connections in telecom applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stability and reliability even in demanding telecom environments.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can function effectively in a wide range of environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, optimizing design flexibility in telecom interfaces.

Maximum Seated Height: 0.5 mm

The low maximum seated height allows for a compact and slim profile, ideal for space-constrained telecom applications.

Width: 1.88 mm

The narrow width of 1.88 mm enables high-density packaging of telecom interface components, saving board space.

Maximum Time At Peak Reflow Temperature: 30s

The short maximum time at peak reflow temperature minimizes thermal stress during assembly, ensuring product reliability.

Peak Reflow Temperature: 260C

The high peak reflow temperature tolerance makes this product suitable for lead-free soldering processes, meeting industry standards.

Length: 3 mm

The compact length of 3 mm allows for efficient placement of the telecom interface IC in space-limited designs.

Terminal Form: BALL

The ball terminal form enhances electrical connection quality and ensures secure attachment in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

This telecom circuit type IC is specifically designed for telecom applications, guaranteeing optimal performance and compatibility.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is commonly used in telecom systems, ensuring seamless integration with existing power sources.

Terminal Pitch: 0.4 mm

The tight terminal pitch of 0.4 mm enables high-speed data transmission and precise signal routing in telecom interfaces.

Data Rate: 0.002 Mbps

With a data rate of 0.002 Mbps, this product is suitable for low-speed telecom communication applications, delivering reliable connectivity.

Technical Specifications

Other Function Telecom Interface ICs BQ51013AYFPT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.002 Mbps

JESD-30 Code:

R-PBGA-B28

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.88 mm

Trade Compliance

BQ51013AYFPT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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