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BQ51011YFFR

Texas Instruments

BQ51011YFFR by Texas Instruments

BQ51011YFFR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from 0 to 125°C. It features TIN SILVER COPPER finish, 0.4mm pitch, and 5V supply voltage. Ideal for TELECOM CIRCUITS due to its compact size and fine pitch design.

Median Price

$3.370

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

$3.370

100+ parts

$3.300

1k+ parts

$3.240

10k+ parts

-

6,000

$3.370

$3.300

$3.240

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 400 parts In-Stock

1+ parts

$3.810

100+ parts

-

1k+ parts

-

10k+ parts

-

400

$3.810

-

-

-

Vyrian

USA . 3,939 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

-

10k+ parts

-

3,939

$4.010

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,987 parts In-Stock

1+ parts

$3.410

100+ parts

-

1k+ parts

-

10k+ parts

-

5,987

$3.410

-

-

-

Semicontronic

India . 5,617 parts In-Stock

1+ parts

$3.410

100+ parts

$3.325

1k+ parts

$3.308

10k+ parts

-

5,617

$3.410

$3.325

$3.308

-

Corphita

USA . 2,852 parts In-Stock

1+ parts

$3.609

100+ parts

-

1k+ parts

-

10k+ parts

-

2,852

$3.609

-

-

-

Corohmni

South Africa . 285 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$4.010

-

-

-

Parana Technologies

USA . 1,461 parts In-Stock

1+ parts

$7.717

100+ parts

-

1k+ parts

$8.249

10k+ parts

-

1,461

$7.717

-

$8.249

-

DigiPath Technology Company

USA . 1,733 parts In-Stock

1+ parts

$8.498

100+ parts

$7.818

1k+ parts

-

10k+ parts

-

1,733

$8.498

$7.818

-

-

IDEA Electronic Components Group

UK . 1,949 parts In-Stock

1+ parts

$8.671

100+ parts

$8.237

1k+ parts

$7.804

10k+ parts

-

1,949

$8.671

$8.237

$7.804

-

ChromeModa Solutions

Germany . 1,853 parts In-Stock

1+ parts

$8.671

100+ parts

$7.110

1k+ parts

-

10k+ parts

-

1,853

$8.671

$7.110

-

-

Microchip USA

USA . 187 parts In-Stock

1+ parts

$25.220

100+ parts

$25.140

1k+ parts

$25.140

10k+ parts

$25.060

187

$25.220

$25.140

$25.140

$25.060

Kepictronics

USA . 12,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,785

-

-

-

-

Perfect Parts

USA . 6,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,160

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

-

-

-

-

Alle Elektronik GmbH

Germany . 1,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,078

-

-

-

-

Northwest PG Solutions

USA . 991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

991

-

-

-

-

Native Components

USA . 284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

284

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Authorized Procurement Solutions

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Unlock the power of seamless connectivity with the BQ51011YFFR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications in the telecommunications industry, this product delivers exceptional value to customers. Experience the benefits of cutting-edge technology and enhanced performance with the BQ51011YFFR, setting new standards in innovation and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components onto circuit boards, making this product suitable for mass production.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making it easier to integrate this component into various electronic devices.

No. of Terminals: 28

With a higher number of terminals, this product can provide more connectivity options and functionality, making it versatile for different applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch ensures high-density mounting, enabling compact designs and saving space in electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding environmental conditions, making this product durable and long-lasting.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows this product to function effectively in a wide range of temperature environments, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term reliability of the product.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and assembly, making it more convenient for manufacturers to integrate this component into their electronic devices.

Maximum Seated Height: 0.625 mm

The low maximum seated height of 0.625 mm allows for a compact overall design, enabling this product to be used in space-constrained applications.

Width: 1.56 mm

The narrow width of 1.56 mm contributes to the compact size of this product, making it suitable for use in small electronic devices where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during assembly, ensuring the reliability and longevity of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient soldering during assembly, ensuring secure connections and stable performance of the product.

Length: 2.76 mm

The compact length of 2.76 mm contributes to the overall small footprint of this product, making it suitable for applications where space is limited.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, making it easier to solder and ensuring the stability of the product during operation.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type IC, this product is specifically designed for telecommunications applications, ensuring optimal performance and compatibility in telecom systems.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this product is compatible with standard voltage levels used in electronic devices, making it easy to integrate into existing systems.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting and facilitates precise connections, making this product suitable for compact and intricate electronic designs.

Technical Specifications

Other Function Telecom Interface ICs BQ51011YFFR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Length:

2.76 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.56 mm

Trade Compliance

BQ51011YFFR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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