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TDK5110FHTMA1

Infineon Technologies

TDK5110FHTMA1 by Infineon Technologies

Infineon's TDK5110FHTMA1 is a telecom IC with 10 terminals, operating at -40 to 125°C. It has a supply voltage of 3V and consumes 0.021mA current. This small outline IC in plastic package is ideal for automotive telecom applications.

Median Price

$1.240

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 3,450 parts In-Stock

1+ parts

$2.700

100+ parts

$1.980

1k+ parts

$1.640

10k+ parts

$1.610

3,450

$2.700

$1.980

$1.640

$1.610

Farnell

UK . 1,190 parts In-Stock

1+ parts

-

100+ parts

$0.815

1k+ parts

$0.747

10k+ parts

-

1,190

-

$0.815

$0.747

-

Rochester

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

46

-

$1.240

$1.110

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 103 parts In-Stock

1+ parts

$1.302

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$1.302

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$3.520

-

-

-

Chip Stock

USA . 38,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38,500

-

-

-

-

Vyrian

USA . 3,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,625

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 46 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

46

$1.160

-

-

-

Semicontronic

India . 46 parts In-Stock

1+ parts

$1.160

100+ parts

$1.131

1k+ parts

$1.125

10k+ parts

-

46

$1.160

$1.131

$1.125

-

Corphita

USA . 671 parts In-Stock

1+ parts

$1.233

100+ parts

-

1k+ parts

-

10k+ parts

-

671

$1.233

-

-

-

Argo Parts USA

USA . 1,110 parts In-Stock

1+ parts

$1.827

100+ parts

-

1k+ parts

-

10k+ parts

-

1,110

$1.827

-

-

-

Continental Prestige Electronics

USA . 260 parts In-Stock

1+ parts

$3.280

100+ parts

$3.080

1k+ parts

-

10k+ parts

-

260

$3.280

$3.080

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

$3.344

10k+ parts

$3.274

1,000

$3.520

-

$3.344

$3.274

Corohmni

South Africa . 342 parts In-Stock

1+ parts

$11.875

100+ parts

-

1k+ parts

-

10k+ parts

-

342

$11.875

-

-

-

Aztec Data Supply Inc.

USA . 84 parts In-Stock

1+ parts

$12.190

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$12.190

-

-

-

AZTECH Wire

Italy . 1,068 parts In-Stock

1+ parts

$12.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,068

$12.500

-

-

-

Modulus Dynamics

Lithuania . 4,453 parts In-Stock

1+ parts

$17.286

100+ parts

$16.595

1k+ parts

$15.903

10k+ parts

-

4,453

$17.286

$16.595

$15.903

-

RC Electronics

USA . 44,429 parts In-Stock

1+ parts

-

100+ parts

$2.230

1k+ parts

$2.030

10k+ parts

$1.970

44,429

-

$2.230

$2.030

$1.970

Lixinc

USA . 13,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,931

-

-

-

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Perfect Parts

USA . 11,206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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11,206

-

-

-

-

Authorized Procurement Solutions

USA . 2,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,590

-

-

-

-

Overview

Discover the cutting-edge TDK5110FHTMA1 by Infineon Technologies, a high-quality Other Function Telecom Interface IC designed for automotive applications. Infineon's reputation for reliability and innovation shines through in this product, offering customers exceptional value and performance. With a compact design, wide temperature range, and low power consumption, this telecom circuit is a game-changer for your automotive electronics needs. Upgrade your systems with the best - choose the TDK5110FHTMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 2.1/4

Offers flexibility in power supply options, enabling compatibility with a range of devices and systems.

Minimum Operating Temperature: -40 °C

Can perform in extremely low temperature environments, making it suitable for various applications and industries.

Maximum Seated Height: 1.1 mm

Low profile design allows for space-saving installation in compact devices or systems.

Temperature Grade: AUTOMOTIVE

Designed to meet stringent automotive industry standards, ensuring reliability and performance in automotive applications.

Technology: BIPOLAR

Utilizes bipolar technology for efficient signal processing and communication, enhancing overall product functionality.

Nominal Supply Voltage: 3 V

Operates at a standard voltage level commonly used in electronic devices, ensuring compatibility with a wide range of systems.

Technical Specifications

Other Function Telecom Interface ICs TDK5110FHTMA1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Infineon Technologies

Specs

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.1/4

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.021 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TDK5110FHTMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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