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MAX7042ATJ

Analog Devices

MAX7042ATJ by Analog Devices

Analog Devices' MAX7042ATJ is a telecom IC with 32 terminals, operating at -40 to 125 °C. It has a supply voltage of 3/5 V and consumes 0.0086 mA current. This CMOS technology chip carrier is ideal for automotive applications due to its low profile and quad terminal position.

Median Price

$4.147

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 140 parts In-Stock

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Nova Conductors

Japan . 25 parts In-Stock

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$4.147

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Digiode

USA . 2,812 parts In-Stock

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Anansix

USA . 2,523 parts In-Stock

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Vyrian

USA . 458 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

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$4.064

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$3.901

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$3.901

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Argo Parts USA

USA . 4,920 parts In-Stock

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Continental Prestige Electronics

USA . 4,739 parts In-Stock

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$4.147

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$4.064

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MARBEL Systems

Belgium . 5,665 parts In-Stock

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$13.469

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Texas Native Microelectronics

USA . 100 parts In-Stock

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$15.482

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$14.398

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Kenton Components

USA . 10 parts In-Stock

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$18.578

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$16.349

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$16.349

AZTECH Wire

Italy . 737 parts In-Stock

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$18.896

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Qasali Group International

UK . 685 parts In-Stock

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$41.801

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One Stop Electronics

USA . 299 parts In-Stock

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Semicontronic

India . 765 parts In-Stock

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$736.000

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$717.600

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$713.920

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765

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Ampacity Inc.

Singapore . 1,515 parts In-Stock

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$773.000

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Corphita

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Enhance your telecom systems with the MAX7042ATJ by Analog Devices, a top-quality manufacturer known for cutting-edge technology. This innovative product falls under the category of Other Function Telecom Interface ICs, providing unparalleled performance and reliability. With surface mount capability and a temperature grade suitable for automotive applications, this chip carrier offers customers a compact and efficient solution. Experience seamless communication and enhanced connectivity with the MAX7042ATJ, a must-have for any telecom project seeking optimal functionality and value.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly on PCBs, saving time and cost in manufacturing.

Package Shape: SQUARE

Square package shape offers efficient use of space on the PCB layout, maximizing component density.

Power Supplies (V): 3/5

Support for multiple power supply voltages (3V and 5V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 32

High number of terminals provide extensive connectivity options for interfacing with other components or devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style enhances thermal performance and space efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in a wide range of environments and applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables this product to function in extreme cold conditions without any issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity, making it easy to solder and ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal position allows for multiple connections, improving signal integrity and reducing interference.

Maximum Seated Height: 0.8 mm

Low maximum seated height minimizes the overall profile of the component on the PCB, ideal for space-constrained designs.

Width: 5 mm

Compact width dimension saves PCB real estate, enabling efficient layout and design.

Length: 5 mm

Compact length dimension saves PCB real estate, enabling efficient layout and design.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the product can withstand the harsh temperature conditions typically encountered in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the product.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead-related hazards, making it environmentally friendly and compliant with regulations.

Maximum Supply Current: 0.0086 mA

Low maximum supply current consumption contributes to energy efficiency and helps reduce overall system power consumption.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, ensuring optimized performance and reliability in telecommunications systems.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3V ensures consistent and reliable operation in telecom applications.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables high-density packaging, maximizing connectivity options in a compact footprint.

Technical Specifications

Other Function Telecom Interface ICs MAX7042ATJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0086 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX7042ATJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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