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MAX7032ATJ+T

Analog Devices

MAX7032ATJ+T by Analog Devices

Analog Devices' MAX7032ATJ+T is a CMOS telecom IC with 32 terminals, operating at -40 to 125 °C. It has a supply voltage of 2.7V and low current draw of 0.0204 mA, suitable for automotive applications requiring a compact square chip carrier package with surface mount capability.

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MAX7032ATJ+T by Analog Devices
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J2 Sourcing AB

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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AZTECH Wire

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Advanced Electronics

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Overview

Enhance your telecommunications systems with the MAX7032ATJ+T by Analog Devices. This innovative telecom interface IC boasts top-notch quality and reliability, thanks to Analog Devices' stellar reputation in the industry. With a wide range of applications in various devices, this product offers unmatched value and benefits for customers seeking seamless connectivity solutions. Upgrade your system today with the MAX7032ATJ+T and experience exceptional performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape provides symmetry and uniformity, enhancing the overall aesthetics of the product.

Power Supplies (V): 2.7

Operates at a low voltage of 2.7V, which is suitable for telecom applications and helps in reducing power consumption.

No. of Terminals: 32

High number of terminals provide a greater degree of connectivity options and flexibility in circuit design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Features chip carrier package style with a heat sink/slug and very thin profile, enabling efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in a wide range of environments, including automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation even in cold conditions without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin terminal finish provides good solderability and corrosion resistance for a reliable connection.

Terminal Position: QUAD

Quad terminal position offers enhanced stability and connectivity, ensuring secure connections during operation.

Maximum Seated Height: 0.8 mm

Low maximum seated height saves valuable space on the circuit board and allows for compact designs.

Width: 5 mm

Compact width dimension enables easy integration into various circuit board layouts and designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures that the product undergoes minimal thermal stress during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder connections and ensures durability during assembly processes.

Length: 5 mm

Compact length dimension contributes to the overall space-saving design of the product.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates that the product meets rigorous industry standards for reliability and performance in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making it suitable for telecom interface applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and enhances environmental sustainability.

Maximum Supply Current: 0.0204 mA

Low maximum supply current contributes to energy efficiency and reduces power consumption in telecom interfaces.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC type ensures optimal performance and compatibility in telecom applications.

Nominal Supply Voltage: 2.7 V

Ideal nominal supply voltage of 2.7V ensures compatibility with standard power sources in telecom systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and facilitates intricate circuit designs.

Technical Specifications

Other Function Telecom Interface ICs MAX7032ATJ+T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0204 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX7032ATJ+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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