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MAX7030MATJ-T

Analog Devices

MAX7030MATJ-T by Analog Devices

Analog Devices' MAX7030MATJ-T is a CMOS IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 125 °C, suitable for automotive applications. It has dual power supplies of 2.5/5V and consumes a max current of 20.4mA, making it ideal for telecom interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,670 parts In-Stock

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Digiode

USA . 1,423 parts In-Stock

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Anansix

USA . 736 parts In-Stock

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736

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MARBEL Systems

Belgium . 3,959 parts In-Stock

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$5.225

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$5.225

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Texas Native Microelectronics

USA . 700 parts In-Stock

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$6.006

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$5.766

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$5.586

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$5.285

700

$6.006

$5.766

$5.586

$5.285

Kenton Components

USA . 2,960 parts In-Stock

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$7.207

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$6.342

2,960

$7.207

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$6.342

AZTECH Wire

Italy . 864 parts In-Stock

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$13.216

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864

$13.216

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Qasali Group International

UK . 700 parts In-Stock

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$16.216

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$15.081

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$14.270

700

$16.216

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$14.270

One Stop Electronics

USA . 2,036 parts In-Stock

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$91.000

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$91.000

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Semicontronic

India . 1,259 parts In-Stock

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$785.000

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$765.375

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$761.450

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Corphita

USA . 2,077 parts In-Stock

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Overview

Enhance your telecom interface systems with the MAX7030MATJ-T by Analog Devices. Made with top-quality materials and cutting-edge technology, this chip carrier package offers reliable performance in automotive-grade environments. With a low supply current of 20.4 mA and dual power supplies, customers can expect optimal efficiency and functionality. Perfect for a variety of applications, this product is a must-have for anyone looking to elevate their telecommunications setup. Upgrade your systems today with the MAX7030MATJ-T and experience unparalleled quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for various conditions.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort in manufacturing processes.

Power Supplies (V): 2.5/5

Offers flexibility in power supply options, allowing for compatibility with a range of systems.

Package Style (Meter): CHIP CARRIER

Enhances thermal dissipation capabilities and overall performance of the IC, ensuring reliability in operation.

Maximum Operating Temperature: 125 °C

Ensures stable operation in high-temperature environments, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in low-temperature conditions, making the product versatile in harsh climates.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity, ideal for efficient and reliable operation.

Terminal Position: QUAD

Offers convenient connectivity options for multiple connections, enhancing versatility and usability.

Technical Specifications

Other Function Telecom Interface ICs MAX7030MATJ-T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e0

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

20.4 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

MAX7030MATJ-T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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