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MAX7032ATJ

Analog Devices

MAX7032ATJ by Analog Devices

Analog Devices' MAX7032ATJ is a CMOS telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 125 °C, it requires 2.7V supply voltage and draws 0.0204mA current. Ideal for automotive applications due to its low profile and quad terminal position.

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4

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1k+

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Vyrian

USA . 8,010 parts In-Stock

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Digiode

USA . 1,878 parts In-Stock

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Anansix

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Prism Electronics

USA . 4 parts In-Stock

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MARBEL Systems

Belgium . 328 parts In-Stock

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$11.774

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Texas Native Microelectronics

USA . 198 parts In-Stock

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$13.533

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$12.992

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$12.586

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$11.909

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Kenton Components

USA . 3,374 parts In-Stock

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$16.240

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$14.291

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AZTECH Wire

Italy . 579 parts In-Stock

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Qasali Group International

UK . 3,147 parts In-Stock

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$33.981

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$32.154

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One Stop Electronics

USA . 1,688 parts In-Stock

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$144.000

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Semicontronic

India . 1,424 parts In-Stock

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$830.700

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$826.440

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Kepictronics

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Corphita

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Authorized Procurement Solutions

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Overview

Enhance your telecommunications systems with the MAX7032ATJ by Analog Devices. Known for its superior quality and reliability, Analog Devices is a trusted manufacturer in the industry. This Other Function Telecom Interface IC offers a range of applications, providing customers with seamless connectivity solutions. With a low supply current and wide temperature range, this product ensures optimal performance in any environment. Elevate your communications with the MAX7032ATJ and experience unparalleled value and benefits. Trust Analog Devices to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, resulting in a compact and space-saving design.

Package Shape: SQUARE

The square package shape provides stability and easy alignment during assembly, ensuring a reliable connection.

Power Supplies (V): 2.7

Operates at a low voltage, making it energy-efficient and suitable for various applications.

No. of Terminals: 32

With a high number of terminals, this product offers multiple connection points for enhanced functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design provides efficient heat dissipation and space-saving benefits.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold temperatures, ensuring reliability in harsh conditions.

Terminal Finish: TIN LEAD

The tin lead finish offers good solderability and conductivity for secure connections.

Terminal Position: QUAD

The quad terminal position enables easy mounting and alignment on the PCB.

Maximum Seated Height: 0.8 mm

The low seated height allows for a compact design and efficient use of space.

Width: 5 mm

The 5mm width provides a balanced size for easy integration into various system configurations.

Length: 5 mm

The 5mm length offers a compact form factor for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting the stringent requirements for temperature and reliability in vehicles.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high integration capabilities.

Terminal Form: NO LEAD

The no lead terminal form eliminates the risk of lead contamination and ensures environmental compatibility.

Maximum Supply Current: 0.0204 mA

Operates at a low supply current, contributing to energy efficiency and minimal power consumption.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and reliability in communication systems.

Nominal Supply Voltage: 2.7 V

Operates at a nominal supply voltage of 2.7V, suitable for telecom applications and energy-efficient operation.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides compact connections and optimal space utilization on the PCB.

Technical Specifications

Other Function Telecom Interface ICs MAX7032ATJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0204 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MAX7032ATJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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