Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX7060ATG+ by Maxim Integrated is a 24-terminal telecom IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a package style of CHIP CARRIER and matte tin finish, it's ideal for telecom circuit interfaces in compact spaces.
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Perfect Parts
This product can be easily mounted on PCBs, making it convenient for manufacturing processes.
The square shape helps in efficient use of board space and allows for easy alignment during assembly.
With a sufficient number of terminals, this IC can support complex telecom functions effectively.
The chip carrier style with a thin profile saves space and enhances overall board density.
This high operating temperature range ensures reliable performance in various environments.
With a wide temperature range, this IC can withstand extreme conditions with ease.
The matte tin finish provides a durable and reliable connection for long-term use.
The quad terminal position offers stability and ease of soldering during installation.
The low profile design enables compact and space-efficient PCB layouts.
The narrow width of the IC allows for placement in tight spaces on the board.
This IC can withstand peak reflow temperatures for a short duration, ensuring proper soldering.
The high peak reflow temperature tolerance guarantees secure and stable connections.
The short length of the IC contributes to a more streamlined design and layout.
Suitable for automotive applications, this IC meets stringent quality and reliability standards.
This CMOS technology ensures low power consumption and high-speed operation.
The lead-free terminal form complies with modern environmental regulations.
Specifically designed for telecom applications, this IC delivers optimal performance in communication systems.
The low supply voltage requirement makes this IC energy-efficient and cost-effective.
The fine terminal pitch allows for high-density integration and precise connections on the board.
Other Function Telecom Interface ICs MAX7060ATG+ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MAX7060ATG+ Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
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Vivek Jain
Fabrication
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Philippines
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489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
Onsemi
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Hy Electronic
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
SIM7070G
Simcom Wireless Solutions
SIM7070G by Simcom Wireless Solutions is a telecom IC with 1.119 Mbps data rate, suitable for industrial use. It operates b/w -40 to 85°C, has 68 terminals in a square package shape, and is surface mountable.
ZED-F9P-02B
U-blox Ag
The U-blox Ag ZED-F9P-02B is a GNSS module with 54 terminals, operating temperature range of -40 to 85°C. It is surface mountable and designed for industrial applications requiring precise positioning and timing accuracy. The TS 16949 screening level ensures high quality standards for telecom interfaces.
ATA5551M-PPMY
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -40 Cel; Terminal Position: UNSPECIFIED;
JODY-W377-00B
TELECOM CIRCUIT;
USB3740B-AI9TR
Standard Microsystems
USB3740B-AI9TR by Standard Microsystems is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a thin profile chip carrier package style, suitable for industrial applications at 5V supply voltage. With surface mount and quad terminal position, it's ideal for compact telecom circuit designs.
EFR32BG22C222F352GN32-C
Silicon Labs
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4;
BGM113A256V21R
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
TESEO-LIV3F
STMicroelectronics
TESEO-LIV3F by STMicroelectronics is a telecom IC with 18 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and compact dimensions of 9.7mm width and 10.1mm length. Ideal for industrial applications requiring a telecom circuit with a terminal pitch of 1.1mm in a rectangular package style.
MAX24287ETK+T
Microchip Technology
MAX24287ETK+T by Microchip Tech is a 68-terminal IC with 1.2V supply voltage, supporting SONET applications at 1000Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and features a square chip carrier package style with 0.4mm terminal pitch.
ETRX357HR
ETRX357HR by Silicon Labs is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. Ideal for industrial applications requiring telecom circuit interfaces in compact MICROELECTRONIC ASSEMBLY package style.
MGM240PA32VNN3
SI4432-B1-FMR
SI4432-B1-FMR by Silicon Labs is a 20-terminal telecom IC with a square shape and chip carrier package. Operating b/w -40 to 85°C, it has a nominal voltage of 3V. Ideal for industrial applications requiring a very thin profile and no-lead terminal form.
ATECC508A-MAHDA-T
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;
ESP32-D0WD
Espressif Systems (shanghai)
ESP32-D0WD by Espressif Systems is a telecom IC with 38 terminals, operating at -40 to 85°C. It has a data rate of 150 Mbps and operates at 3.3V supply voltage. This surface-mount rectangular package is ideal for automotive applications due to its compact size and high performance capabilities.
AT86RF215-ZUR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
BGM13P22F512GE-V2
RS9116W-SB00-B00-X23
Silicon Labs RS9116W-SB00-B00-X23 is a telecom IC with 126 terminals, operating from -40 to 85°C. It has a supply voltage of 1.85V and MSL level of 3, suitable for industrial applications requiring reliable telecom circuit interfaces in surface-mount packages.
LEA-M8F-0-00
LEA-M8F-0-00 by U-blox Ag is a telecom IC with 28 terminals, operating at -40 to 85°C. Its package style is MICROELECTRONIC ASSEMBLY, suitable for INDUSTRIAL applications. With a supply voltage of 3.3V and AEC-Q100 screening, it's ideal for robust telecom interfaces.
BT121-A-V2
BT121-A-V2 by Silicon Labs is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1mm. This surface-mount IC is ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages.
LEA-M8T-0
LEA-M8T-0 by U-blox Ag is a telecom IC with 28 terminals, operating at -40 to 85°C. With a compact size of 17x22.4mm, it has a supply voltage of 3V and MSL level of 4. Ideal for industrial applications requiring precise telecom circuit interfacing in tight spaces.
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MAX41460GUB+
Maxim
CONSUMER CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
MAX7044AKA+T
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX7044AKA-T
Analog Devices
MAX7042ATJ
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MAX7042ATJ+
MAX7033EUI+
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
MAX7033EUI+ by Analog Devices is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and uses CMOS technology. This IC is ideal for telecom circuits in industrial applications due to its small outline package and dual terminal position.
MAX7033EUI
MAX7037EGL+
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Terminal Finish: NICKEL GOLD PALLADIUM; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD PALLADIUM;
MAX7060ATG/V+
MAX7060ATG/V+ by Maxim Integrated is a telecom interface IC with 1 function. It operates at temperatures ranging from -40 to 125°C and has a nominal voltage of 2.7V. This chip carrier, heat sink/slug package is suitable for automotive applications.
MAX7030MATJ+
MAX7032ATJ-T
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
MAX7032ATJ
MAX7030MATJ-T
Other Telecom ICs; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
MAX7032ATJ+T
MAX7032ATJ+
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