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WL1801MODGBMOC

Texas Instruments

WL1801MODGBMOC by Texas Instruments

WL1801MODGBMOC by Texas Instruments is a telecom IC with 130 terminals in a rectangular grid array package. Operating temperature ranges from -20 to 70°C, with a nominal voltage of 3.7V. It is used for telecom circuit applications requiring surface mount technology and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,799 parts In-Stock

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5,799

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Digiode

USA . 1,518 parts In-Stock

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1,518

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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AZTECH Wire

Italy . 728 parts In-Stock

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$6.003

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728

$6.003

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Parana Technologies

USA . 1,856 parts In-Stock

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$10.075

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$10.628

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1,856

$10.075

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$10.628

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ChromeModa Solutions

Germany . 5,941 parts In-Stock

1+ parts

$11.320

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$9.282

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5,941

$11.320

$9.282

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IDEA Electronic Components Group

UK . 608 parts In-Stock

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$11.320

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$10.754

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$10.188

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608

$11.320

$10.754

$10.188

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Microchip USA

USA . 4,605 parts In-Stock

1+ parts

$26.320

100+ parts

$25.940

1k+ parts

$25.750

10k+ parts

$25.570

4,605

$26.320

$25.940

$25.750

$25.570

One Stop Electronics

USA . 1,086 parts In-Stock

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$461.000

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$461.000

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Ampacity Inc.

Singapore . 811 parts In-Stock

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$500.000

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811

$500.000

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Corphita

USA . 3,125 parts In-Stock

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DigiPath Technology Company

USA . 1,703 parts In-Stock

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$10.206

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$10.206

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock seamless connectivity with the WL1801MODGBMOC by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This telecom interface IC offers unparalleled reliability and performance, making it ideal for a wide range of applications. With a compact package and innovative design, this product delivers value and efficiency to customers looking for high-quality solutions. Say goodbye to connectivity issues and experience the benefits of superior technology with the WL1801MODGBMOC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, ideal for portable telecom devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Terminals: 130

Having a larger number of terminals provides greater flexibility in connectivity options, making this product versatile for different telecom applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, increasing the product's longevity.

Nominal Supply Voltage: 3.7 V

The nominal supply voltage of 3.7V is commonly used in telecom applications, ensuring compatibility with existing systems and ease of integration.

Technical Specifications

Other Function Telecom Interface ICs WL1801MODGBMOC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B130

Length:

13.4 mm

No. of Functions:

1

No. of Terminals:

130

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

13.3 mm

Trade Compliance

WL1801MODGBMOC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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