Loading...

SA639

NXP Semiconductors

SA639 by NXP Semiconductors

SA639 by NXP Semiconductors is a versatile telecom interface IC designed for industrial applications. It operates at 3/5V with a temp range of -40 °C to 85 °C and features a compact 24-terminal gull-wing package. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,580

-

-

-

-

Vyrian

USA . 3,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,932

-

-

-

-

Anansix

USA . 2,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 214 parts In-Stock

1+ parts

$286.000

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$286.000

-

-

-

UNI Independent Distributors

Spain . 8,027 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,027

-

-

-

-

Corphita

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,447

-

-

-

-

Overview

Unlock unparalleled performance with the SA639 from NXP Semiconductors—your go-to solution for reliable telecom interfaces. Designed for industrial applications, this robust IC ensures seamless communication in challenging environments, delivering exceptional quality and durability. With NXP’s trusted expertise, you gain a competitive edge through enhanced functionality and efficiency, making the SA639 an invaluable asset for your next project. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and resistance to environmental factors, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for efficient assembly with high-density circuit boards, enabling compact designs and improved performance.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on the PCB and ensures easier layout and routing, which is crucial for complex designs.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies provides flexibility in various applications, accommodating different system requirements and designs.

No. of Terminals: 24

With 24 terminals, the product offers ample connectivity options for multi-functionality, ensuring it can meet complex integration needs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable space on the PCB, making it a great choice for space-constrained applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability in high-temperature environments, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables functionality in extreme cold temperatures, enhancing versatility in diverse environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and design, facilitating better connectivity and integration options.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this product ensures reliable operation in varying environmental conditions, particularly in demanding industrial settings.

Technology: BIPOLAR

Bipolar technology allows for fast switching speeds and high gain, making this IC efficient for telecom interface applications requiring high performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering characteristics, ensuring reliable connections in a range of applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm is compatible with standard PCB designs, allowing for easier integration and assembly within existing technologies.

Technical Specifications

Other Function Telecom Interface ICs SA639 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SA639 Telecommunications trade compliance attributes, and parameters.

NSN

7530-66-117-7398, 7530661177398

NIIN

661177398

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20