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SA639DH-T

Philips Semiconductors

SA639DH-T by Philips Semiconductors

Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;

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Digiode

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Vyrian

USA . 2,901 parts In-Stock

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Anansix

USA . 219 parts In-Stock

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One Stop Electronics

USA . 1,560 parts In-Stock

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$142.000

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Corphita

USA . 3,591 parts In-Stock

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UNI Independent Distributors

Spain . 992 parts In-Stock

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Technical Specifications

Other Function Telecom Interface ICs SA639DH-T attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Philips Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

10 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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