Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MFRC52302HN1/TRAYBM by NXP Semiconductors is a telecom interface IC designed for surface mount applications. It operates b/w -25 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile chip carrier package. Ideal for compact electronic devices, it has 32 terminals in a quad configuration.
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UNI Independent Distributors
The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for various applications.
Surface mount technology (SMT) allows for easier integration into modern electronics, reducing PCB space while enabling automated assembly.
The square package shape optimizes layout and space utilization on the circuit board, which is beneficial for compact design.
With 32 terminals, the product provides ample connectivity options for complex designs, allowing for greater functionality.
The very thin profile minimizes height, which is advantageous for space-constrained designs and contributes to overall system compactness.
Operating at temperatures up to 85 °C ensures reliability and performance in demanding environments without risk of overheating.
The ability to function in low temperatures enhances versatility, making it suitable for outdoor and extreme condition applications.
The quad terminal position improves signal integrity and makes it efficient for layout design, reducing the potential for interference.
A maximum seated height of only 1 mm enables low-profile designs, perfect for modern, compact consumer electronics.
The compact width allows for effective utilization of space in circuit boards, making it suitable for miniaturized electronic devices.
The small length complements the overall compact design, allowing for placement flexibility in a variety of applications.
No lead design contributes to the reduction of electromagnetic interference (EMI) and enhances thermal performance.
As a telecom circuit IC, it is specifically designed for communication applications, ensuring optimized performance for telecom systems.
The nominal supply voltage of 3.3 V aligns with many modern digital circuits, facilitating easy integration and compatibility.
A 0.5 mm terminal pitch allows for higher density mounting on PCBs, making it suitable for advanced technology applications.
Other Function Telecom Interface ICs MFRC52302HN1/TRAYBM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
MFRC52302HN1/TRAYBM Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
LM78L05ACMX/NOPB
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LAN8720A-CP-TR
LAN8720A-CP-TR by Microchip: Ethernet transceiver with 100 Mbps data rate, operates at 3.3V, and consumes 54mA max supply current. Ideal for network interfaces in commercial applications due to its small size (4x4mm) and low power consumption.
Electronic Devices
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
Zetex Plc
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
Cheng-yi Electronic
CC2530F256RHAR
CC2530F256RHAR by Texas Instruments is a telecom IC with 40 terminals, operating from -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no-lead terminal form.
MAYA-W160-00B
U-blox Ag
TELECOM CIRCUIT;
CC430F5137IRGZR
CC430F5137IRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.5 Mbps. Ideal for industrial applications requiring low-profile surface mount components.
MAX-M8Q
BMD-345-A-R
LTC5596IDC#TRMPBF
Linear Technology
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
SPIRIT1QTR
STMicroelectronics
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
DWM1000
Decawave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ESP32-WROVER-B(M213DH6464PC3Q0)
Espressif Systems (shanghai)
ESP32-WROVER-B by Espressif Systems is a telecom IC with 150 Mbps data rate. It operates at 3.3V, has 38 terminals, and measures 31.4mm x 18mm x 3.45mm. Ideal for applications requiring high-speed wireless connectivity in compact designs.
BGM220SC22HNA2
Silicon Labs
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
AT86RF215-ZUR
Microchip Technology's AT86RF215-ZUR is a 48-terminal RF and baseband circuit IC with a nominal voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and features matte tin terminal finish. This square chip carrier is designed for telecom applications requiring very thin profile package style.
XB3-24Z8CM-J
Digi International
XB3-24Z8CM-J by Digi International is a telecom IC with 34 terminals, suitable for industrial use. It operates b/w -40°C to 85°C, in a rectangular microelectronic assembly package measuring 13mm x 19mm. This surface-mount IC is ideal for various telecom interface applications.
RS9116N-DB00-CC0-B00
NINA-B112-04B
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
NINA-B306-00B-00
MAX7044AKA-T
Maxim Integrated
MAX7044AKA-T by Maxim Integrated is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 2.7V and low power consumption of 0.0257mA, suitable for automotive applications due to its CMOS technology and small form factor.
RN4678-V/RM122
RN4678-V/RM122 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20°C to 70°C. It has a supply voltage of 1.9V and compact dimensions of 12mm width, 22mm length, and 2.46mm height. Ideal for surface mount applications in telecom circuits due to its no-lead terminal form and rectangular package style.
MP45DT02TR-M
STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.
TDA5150
Infineon Technologies
TDA5150 by Infineon Technologies is a telecom interface IC with 10 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 2/3.3V and is designed for telecom circuits, featuring a small outline package suitable for surface mounting applications. The package material is plastic/epoxy with a square shape and gull wing terminal form, making it ideal for industrial temperature grade environments.
MCP2120-I/P
MCP2120-I/P by Microchip Technology is a CMOS telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3/5V and low current draw of 0.016mA. Ideal for telecom circuits, it comes in an industrial-grade rectangular package with matte tin finish.
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MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
MFRC52302HN1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MFRC53001T/0FE,112
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
MFRC63002HN,151
NXP Semiconductors' MFRC63002HN,151 is a telecom IC with 32 terminals in a square chip carrier package. Operating b/w -25 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features a max seated height of 1mm.
MFRC63102HN,151
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;
MFRC63002HN,118
The NXP Semiconductors MFRC63002HN,118 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85°C, with peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 5V and terminal pitch of 0.5mm.
MFRC63002HN
The NXP Semiconductors MFRC63002HN is a telecom interface IC with 1 function. It has a square package and a terminal position of quad. With a max operating temperature of 85°C and min operating temperature of -25°C, it is suitable for various telecom circuit applications.
MFRC63002HN,157
MFRC53101T/0FE
NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.
MFRC63003HNY
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC63002HN/T/R
MFRC531
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
MFRC63002HN/TRAYBM
MFRC63002HN/TRAYB
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
MFRC52301HN1/TRAYBM
MFRC52302HN1/TRAYB
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: VQCCN; Package Shape: SQUARE;
MFRC52301HN1/TRAYB
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