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MFRC53101T/0FE

NXP Semiconductors

MFRC53101T/0FE by NXP Semiconductors

NXP Semiconductors' MFRC53101T/0FE is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. Its small outline package measures 7.5mm in width and 20.5mm in length, suitable for surface mount applications. With a nominal voltage of 5V, it's ideal for various telecom circuit functions.

Median Price

$3.840

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Chip Stock

USA . 25,291 parts In-Stock

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Component Sense

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Vyrian

USA . 152 parts In-Stock

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Martec Srl

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Cyclops Electronics Ltd

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Nova Conductors

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AZTECH Wire

Italy . 210 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Overview

Unlock the power of seamless communication with the MFRC53101T/0FE by NXP Semiconductors. This innovative telecom interface IC is designed with precision and reliability in mind, offering unparalleled quality and performance. Whether you're looking to enhance your telecom systems or streamline your operations, this product delivers value, efficiency, and convenience. Experience the advantages of cutting-edge technology with the MFRC53101T/0FE and take your applications to the next level. Elevate your connectivity solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design, ideal for tight circuit layouts.

No. of Terminals: 32

With 32 terminals, this product offers ample connectivity options for complex telecom interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint of the IC, making it suitable for compact systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25°C makes this IC versatile and suitable for a wide range of operating conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in connection options, allowing for versatile integration in telecom systems.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm enables this IC to be used in slim devices without compromising on performance.

Width: 7.5 mm

The compact width of 7.5 mm makes this IC suitable for applications where space is limited.

Length: 20.5 mm

With a length of 20.5 mm, this IC offers a balanced size for easy integration in various telecom interface designs.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable performance in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this IC is optimized for communication systems, making it a reliable choice for telecom applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is compatible with standard power sources, ensuring easy integration and operation in various systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise soldering and connection, ensuring a reliable and stable electrical interface.

Technical Specifications

Other Function Telecom Interface ICs MFRC53101T/0FE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MFRC53101T/0FE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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