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CC3135MODRNMMOBR

Texas Instruments

CC3135MODRNMMOBR by Texas Instruments

CC3135MODRNMMOBR by Texas Instruments is a telecom IC with 63 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring reliable communication interfaces in compact spaces. With surface mount capability and nickel gold finish, it offers robust connectivity solutions in various electronic devices.

Median Price

$18.322

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,067 parts In-Stock

1+ parts

$13.805

100+ parts

$12.058

1k+ parts

$8.316

10k+ parts

-

5,067

$13.805

$12.058

$8.316

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Mouser Electronics

USA . 558 parts In-Stock

1+ parts

$22.840

100+ parts

$17.490

1k+ parts

$15.140

10k+ parts

-

558

$22.840

$17.490

$15.140

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$11.340

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550

$11.340

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-

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Digiode

USA . 2,106 parts In-Stock

1+ parts

$13.115

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2,106

$13.115

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Vyrian

USA . 3,209 parts In-Stock

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3,209

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Chip Stock

USA . 2,850 parts In-Stock

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2,850

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TME

Poland . 1,500 parts In-Stock

1+ parts

-

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$9.160

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1,500

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-

$9.160

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Velocity Electronics

USA . 764 parts In-Stock

1+ parts

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764

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Bristol Electronics

USA . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,096 parts In-Stock

1+ parts

$8.620

100+ parts

-

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3,096

$8.620

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Semicontronic

India . 2,982 parts In-Stock

1+ parts

$8.620

100+ parts

$8.404

1k+ parts

$8.361

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2,982

$8.620

$8.404

$8.361

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$8.692

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289

$8.692

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$11.113

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$10.669

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1,000

$11.113

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$10.669

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Continental Prestige Electronics

USA . 5,538 parts In-Stock

1+ parts

$11.340

100+ parts

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$11.113

5,538

$11.340

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-

$11.113

Parana Technologies

USA . 842 parts In-Stock

1+ parts

$12.232

100+ parts

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$12.654

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842

$12.232

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$12.654

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Corphita

USA . 4,797 parts In-Stock

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$12.424

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$12.424

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IDEA Electronic Components Group

UK . 1,930 parts In-Stock

1+ parts

$13.744

100+ parts

$13.057

1k+ parts

$12.370

10k+ parts

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1,930

$13.744

$13.057

$12.370

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ChromeModa Solutions

Germany . 724 parts In-Stock

1+ parts

$13.744

100+ parts

$11.270

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724

$13.744

$11.270

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$16.671

100+ parts

$15.171

1k+ parts

$13.670

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500

$16.671

$15.171

$13.670

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Lixinc

USA . 5,894 parts In-Stock

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Argo Parts USA

USA . 972 parts In-Stock

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972

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DigiPath Technology Company

USA . 796 parts In-Stock

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$12.392

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796

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$12.392

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Overview

Elevate your telecommunications projects with the CC3135MODRNMMOBR by Texas Instruments. Crafted with precision and expertise, this cutting-edge telecom interface IC offers unparalleled quality and reliability. Whether you're designing smart devices or IoT solutions, this product provides seamless connectivity and optimized performance. With a temperature grade of industrial and a nominal supply voltage of 3.3V, the CC3135MODRNMMOBR guarantees efficiency even in the most challenging environments. Trust Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Easy and convenient installation on PCB, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Practical and efficient design for fitting into electronic devices.

No. of Terminals: 63

Provides ample connections for various functions and interfaces.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of operating environments without overheating.

Terminal Finish: NICKEL GOLD

Ensures reliable and long-lasting electrical connections.

Width: 17.5 mm

Compact size for integration in space-constrained devices.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage requirements for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs CC3135MODRNMMOBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XQMA-B63

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Trade Compliance

CC3135MODRNMMOBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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