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CC3135RNMRGKR

Texas Instruments

CC3135RNMRGKR by Texas Instruments

Texas Instruments CC3135RNMRGKR is a 64-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features nickel palladium gold finish, no-lead terminal form, and quad position for industrial applications requiring very thin profile chip carriers in a square package shape.

Median Price

$8.740

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,699 parts In-Stock

1+ parts

$6.153

100+ parts

$5.016

1k+ parts

$3.344

10k+ parts

-

11,699

$6.153

$5.016

$3.344

-

DigiKey

USA . 6,500 parts In-Stock

1+ parts

$8.740

100+ parts

$6.626

1k+ parts

$5.843

10k+ parts

$5.572

6,500

$8.740

$6.626

$5.843

$5.572

Mouser Electronics

USA . 394 parts In-Stock

1+ parts

$8.740

100+ parts

$6.630

1k+ parts

$5.300

10k+ parts

$5.290

394

$8.740

$6.630

$5.300

$5.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,100 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

3,100

$4.220

-

-

-

Digiode

USA . 2,453 parts In-Stock

1+ parts

$5.845

100+ parts

-

1k+ parts

-

10k+ parts

-

2,453

$5.845

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,487 parts In-Stock

1+ parts

$5.538

100+ parts

-

1k+ parts

-

10k+ parts

-

2,487

$5.538

-

-

-

Parana Technologies

USA . 452 parts In-Stock

1+ parts

$5.605

100+ parts

$520.530

1k+ parts

$5.045

10k+ parts

-

452

$5.605

$520.530

$5.045

-

Native Components

USA . 682 parts In-Stock

1+ parts

$6.120

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$6.120

-

-

-

DigiPath Technology Company

USA . 1,913 parts In-Stock

1+ parts

$6.172

100+ parts

-

1k+ parts

-

10k+ parts

-

1,913

$6.172

-

-

-

IDEA Electronic Components Group

UK . 2,280 parts In-Stock

1+ parts

$6.298

100+ parts

-

1k+ parts

$5.668

10k+ parts

-

2,280

$6.298

-

$5.668

-

ChromeModa Solutions

Germany . 2,019 parts In-Stock

1+ parts

$6.298

100+ parts

$5.164

1k+ parts

-

10k+ parts

-

2,019

$6.298

$5.164

-

-

Lixinc

USA . 16,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,228

-

-

-

-

Northwest PG Solutions

USA . 932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.998

10k+ parts

-

932

-

-

$5.998

-

Overview

Unleash the power of connectivity with the CC3135RNMRGKR by Texas Instruments. Designed with precision and innovation, this Telecom Interface IC offers unmatched quality and reliability. Perfect for a variety of applications, this chip carrier comes in a sleek square package body material with a very thin profile, making it ideal for space-constrained designs. With a nominal supply voltage of 3.3V and industrial-grade temperature range, this IC ensures optimal performance in any environment. Experience seamless communication and enhanced productivity with the CC3135RNMRGKR, a game-changer in the world of telecom interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a low-cost yet durable package for the telecom interface IC, making it a cost-effective choice for telecommunications applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs for overall system integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this telecom interface IC is suitable for industrial environments where temperatures can fluctuate, ensuring reliable performance under varying conditions.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this telecom IC is compatible with standard power sources, offering energy-efficient operation for telecom applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this telecom interface IC can withstand moderate exposure to moisture during handling and assembly, making it more robust in manufacturing processes.

Technical Specifications

Other Function Telecom Interface ICs CC3135RNMRGKR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC3135RNMRGKR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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