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TUSB211IRWBR

Texas Instruments

TUSB211IRWBR by Texas Instruments

TUSB211IRWBR by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 85 °C. It features a 12-terminal chip carrier package suitable for industrial applications requiring a 3.3 V supply voltage and low current consumption of 0.02 mA.

Median Price

$3.583

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 115 parts In-Stock

1+ parts

$3.563

100+ parts

$2.386

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115

$3.563

$2.386

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Arrow

USA . 115 parts In-Stock

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$3.566

100+ parts

$2.394

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-

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115

$3.566

$2.394

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Texas Instruments

USA . 12,588 parts In-Stock

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$4.044

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$3.544

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$2.002

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12,588

$4.044

$3.544

$2.002

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Mouser Electronics

USA . 2,207 parts In-Stock

1+ parts

$6.310

100+ parts

$4.070

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$3.810

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$3.600

2,207

$6.310

$4.070

$3.810

$3.600

DigiKey

USA . 2,328 parts In-Stock

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$3.600

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$3.600

Verical

USA . 115 parts In-Stock

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$2.394

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115

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$2.394

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Distributors (In-Stock)

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Maritex

Poland . 207 parts In-Stock

1+ parts

$1.549

100+ parts

$1.048

1k+ parts

$0.939

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207

$1.549

$1.048

$0.939

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Nova Conductors

Japan . 37 parts In-Stock

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$1.950

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$1.950

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Digiode

USA . 2,958 parts In-Stock

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$3.385

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$3.385

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Cyclops Electronics Ltd

UK . 172,723 parts In-Stock

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Chip Stock

USA . 33,500 parts In-Stock

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Zilex Electronics Inc.

Canada . 6,000 parts In-Stock

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Vyrian

USA . 3,480 parts In-Stock

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Bristol Electronics

USA . 3,060 parts In-Stock

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3,060

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Sensible Micro Corp

USA . 1,311 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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5

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corohmni

South Africa . 182 parts In-Stock

1+ parts

$1.950

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182

$1.950

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Argo Parts USA

USA . 4,042 parts In-Stock

1+ parts

$1.950

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4,042

$1.950

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Advanced Electronics

New Zealand . 46 parts In-Stock

1+ parts

$2.008

100+ parts

$1.908

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$1.908

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46

$2.008

$1.908

$1.908

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Semicontronic

India . 3,699 parts In-Stock

1+ parts

$2.030

100+ parts

$1.979

1k+ parts

$1.969

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3,699

$2.030

$1.979

$1.969

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Continental Prestige Electronics

USA . 1,051 parts In-Stock

1+ parts

$2.350

100+ parts

$1.740

1k+ parts

$1.290

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1,051

$2.350

$1.740

$1.290

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Corphita

USA . 2,049 parts In-Stock

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$3.207

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$3.207

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Ampacity Inc.

Singapore . 3,502 parts In-Stock

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$4.430

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$4.430

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Parana Technologies

USA . 1,701 parts In-Stock

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$12.587

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$13.042

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$12.587

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$13.042

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

1+ parts

$14.143

100+ parts

$13.436

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$12.729

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2,282

$14.143

$13.436

$12.729

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ChromeModa Solutions

Germany . 2,144 parts In-Stock

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$14.143

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$11.597

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2,144

$14.143

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A-Z Elektronik GmbH

Germany . 12,096 parts In-Stock

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Lixinc

USA . 9,555 parts In-Stock

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Perfect Parts

USA . 8,461 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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DigiPath Technology Company

USA . 988 parts In-Stock

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$12.751

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988

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$12.751

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Overview

The TUSB211IRWBR by Texas Instruments is a top-of-the-line Telecom Interface IC, known for its quality and reliability. With a package style of CHIP CARRIER and a maximum data rate of 480.24 Mbps, this product is perfect for a wide range of telecom applications. From its industrial temperature grade to its very thin profile design, this IC offers unmatched performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets all your telecom needs. Elevate your projects with the TUSB211IRWBR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient assembly onto PCBs, saving time and simplifying manufacturing processes.

Package Shape: SQUARE

Square shape helps optimize space utilization on the PCB and allows for efficient layout design.

No. of Terminals: 12

Offers sufficient connectivity options for versatile integration into telecom systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ensuring reliable performance under varying conditions.

Minimum Operating Temperature: -40 °C

Has a wide operating temperature range, suitable for use in extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal configuration allows for multiple connections, enhancing flexibility in circuit design.

Maximum Seated Height: 0.4 mm

Low-profile design helps reduce overall height of the IC package, ideal for space-constrained applications.

Width: 1.6 mm

Compact width facilitates compact PCB layout and saves space in the system design.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during assembly process, maintaining the integrity of the connections.

Peak Reflow Temperature °C: 260

Withstands high temperatures during reflow soldering, ensuring secure and durable connections.

Length: 1.6 mm

Compact length allows for efficient placement on the PCB and helps optimize the layout design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments, meeting the stringent requirements of industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability.

Maximum Supply Current: 0.02 mA

Low supply current consumption helps in reducing power consumption and enhancing energy efficiency.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in telecom systems.

Nominal Supply Voltage: 3.3 V

Compatible with standard supply voltage levels, facilitating easy integration into existing systems.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable higher density connections, offering more design flexibility in a limited space.

Data Rate: 480.24 Mbps

High data rate capability enables fast and efficient data transmission, suitable for high-speed telecom applications.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, ensuring proper handling and storage requirements for reliable performance.

Technical Specifications

Other Function Telecom Interface ICs TUSB211IRWBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.02 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB211IRWBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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