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TUSB212IRWBR

Texas Instruments

TUSB212IRWBR by Texas Instruments

TUSB212IRWBR by Texas Instruments is a telecom IC with data rate of 480.24 Mbps, operating at 3.3V. It features a package style of CHIP CARRIER and terminal finish of NiPdAu. Ideal for telecom applications due to its low supply current of 0.03mA and industrial temperature grade up to 85°C.

Median Price

$3.336

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 369,325 parts In-Stock

1+ parts

$2.963

100+ parts

$2.597

1k+ parts

$1.467

10k+ parts

-

369,325

$2.963

$2.597

$1.467

-

Mouser Electronics

USA . 11,002 parts In-Stock

1+ parts

$3.710

100+ parts

$2.320

1k+ parts

$1.960

10k+ parts

$1.950

11,002

$3.710

$2.320

$1.960

$1.950

DigiKey

USA . 10,352 parts In-Stock

1+ parts

$3.710

100+ parts

$2.316

1k+ parts

$2.065

10k+ parts

$1.992

10,352

$3.710

$2.316

$2.065

$1.992

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.743

3,000

-

-

-

$1.743

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,471 parts In-Stock

1+ parts

$1.743

100+ parts

-

1k+ parts

-

10k+ parts

-

4,471

$1.743

-

-

-

Digiode

USA . 224 parts In-Stock

1+ parts

$2.622

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$2.622

-

-

-

Chip Stock

USA . 25,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,610

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 98,675 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

98,675

$1.480

-

-

-

Semicontronic

India . 98,499 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

10k+ parts

-

98,499

$1.480

$1.443

$1.436

-

Corohmni

South Africa . 470 parts In-Stock

1+ parts

$1.743

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$1.743

-

-

-

Corphita

USA . 3,066 parts In-Stock

1+ parts

$2.484

100+ parts

-

1k+ parts

-

10k+ parts

-

3,066

$2.484

-

-

-

Parana Technologies

USA . 1,690 parts In-Stock

1+ parts

$11.896

100+ parts

-

1k+ parts

$12.291

10k+ parts

-

1,690

$11.896

-

$12.291

-

DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

$13.099

100+ parts

$12.051

1k+ parts

-

10k+ parts

-

790

$13.099

$12.051

-

-

ChromeModa Solutions

Germany . 5,817 parts In-Stock

1+ parts

$13.366

100+ parts

$10.960

1k+ parts

-

10k+ parts

-

5,817

$13.366

$10.960

-

-

IDEA Electronic Components Group

UK . 593 parts In-Stock

1+ parts

$13.366

100+ parts

$12.698

1k+ parts

$12.029

10k+ parts

-

593

$13.366

$12.698

$12.029

-

A-Z Elektronik GmbH

Germany . 9,165 parts In-Stock

1+ parts

-

100+ parts

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9,165

-

-

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Perfect Parts

USA . 8,040 parts In-Stock

1+ parts

-

100+ parts

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8,040

-

-

-

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,829 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,829

-

-

-

-

iodParts Technologies Inc.

India . 2,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,309

-

-

-

-

Lixinc

USA . 373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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373

-

-

-

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GreenTree Electronics

Israel . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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101

-

-

-

-

Overview

Enhance your telecom interface solutions with the top-quality TUSB212IRWBR by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers products that meet the highest standards of performance and reliability. Ideal for a wide range of applications in the telecom industry, this chip carrier offers unmatched value and benefits to customers looking for seamless connectivity and high-speed data transmission. Trust Texas Instruments to provide you with cutting-edge technology that ensures efficiency and durability in all your telecom projects. Choose the TUSB212IRWBR for superior performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, increasing the product's versatility.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in diverse climates or environments.

Data Rate: 480.24 Mbps

High data rate allows for fast and efficient data transfer, making the product ideal for telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs TUSB212IRWBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB212IRWBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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