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TUSB212RWBR

Texas Instruments

TUSB212RWBR by Texas Instruments

TUSB212RWBR by Texas Instruments is a telecom interface IC with 480.24 Mbps data rate, operating at 3.3V. It features a chip carrier package style, quad terminals, and nickel palladium gold finish. Ideal for telecom circuits, it has a low supply current of 0.03mA and operates b/w 0-70°C.

Median Price

$2.924

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,172 parts In-Stock

1+ parts

$2.578

100+ parts

$2.259

1k+ parts

$1.276

10k+ parts

-

8,172

$2.578

$2.259

$1.276

-

Mouser Electronics

USA . 14,964 parts In-Stock

1+ parts

$3.270

100+ parts

$2.030

1k+ parts

$1.710

10k+ parts

$1.680

14,964

$3.270

$2.030

$1.710

$1.680

DigiKey

USA . 2,427 parts In-Stock

1+ parts

$3.270

100+ parts

$2.028

1k+ parts

$1.803

10k+ parts

$1.374

2,427

$3.270

$2.028

$1.803

$1.374

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.099

3,000

-

-

-

$1.099

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,072 parts In-Stock

1+ parts

$1.099

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

$1.099

-

-

-

Maritex

Poland . 2,036 parts In-Stock

1+ parts

$1.505

100+ parts

$0.769

1k+ parts

$0.608

10k+ parts

-

2,036

$1.505

$0.769

$0.608

-

Digiode

USA . 3,372 parts In-Stock

1+ parts

$2.449

100+ parts

-

1k+ parts

-

10k+ parts

-

3,372

$2.449

-

-

-

Chip Stock

USA . 69,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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69,770

-

-

-

-

Cyclops Electronics Ltd

UK . 50,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50,399

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,522 parts In-Stock

1+ parts

$2.320

100+ parts

-

1k+ parts

-

10k+ parts

-

4,522

$2.320

-

-

-

Parana Technologies

USA . 2,241 parts In-Stock

1+ parts

$13.732

100+ parts

-

1k+ parts

$14.223

10k+ parts

-

2,241

$13.732

-

$14.223

-

DigiPath Technology Company

USA . 795 parts In-Stock

1+ parts

$15.120

100+ parts

$13.911

1k+ parts

-

10k+ parts

-

795

$15.120

$13.911

-

-

ChromeModa Solutions

Germany . 3,929 parts In-Stock

1+ parts

$15.429

100+ parts

$12.652

1k+ parts

-

10k+ parts

-

3,929

$15.429

$12.652

-

-

IDEA Electronic Components Group

UK . 735 parts In-Stock

1+ parts

$15.429

100+ parts

$14.658

1k+ parts

$13.886

10k+ parts

-

735

$15.429

$14.658

$13.886

-

GreenTree Electronics

Israel . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36,000

-

-

-

-

Speed Components Ltd (Excess)

Israel . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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36,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 15,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,534

-

-

-

-

Lixinc

USA . 13,611 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,611

-

-

-

-

Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,720

-

-

-

-

Technoshack Inc. (Excess)

Canada . 6,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,600

-

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Futuretech Components

Singapore . 1,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,146

-

-

-

-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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200

-

-

-

-

iodParts Technologies Inc.

India . 141 parts In-Stock

1+ parts

-

100+ parts

$3.014

1k+ parts

-

10k+ parts

-

141

-

$3.014

-

-

Overview

Discover the innovative TUSB212RWBR by Texas Instruments, a high-quality Telecom Interface IC designed to meet your communication needs. With Texas Instruments' reputation for excellence in manufacturing, this product offers reliability and performance that exceeds expectations. Whether you're looking to enhance your telecom systems or improve data transfer speeds, this versatile chip carrier with a very thin profile is the perfect solution. Benefit from its commercial-grade temperature range, low supply current, and high data rate capabilities. Upgrade your applications with the TUSB212RWBR and experience the value it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and allows for a compact design, making the product suitable for various applications.

Surface Mount: YES

Surface mount design enables easy installation and saves space on the PCB, making it ideal for compact electronic devices.

No. of Terminals: 12

The 12 terminals provide sufficient connectivity options for different telecom interfaces, enhancing versatility and functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand harsh environmental conditions and ensure reliable performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, the product offers energy efficiency and compatibility with common voltage levels in electronic systems.

Data Rate: 480.24 Mbps

High data rate of 480.24 Mbps allows for efficient data transfer, making the product suitable for telecom applications requiring fast communication speeds.

Technical Specifications

Other Function Telecom Interface ICs TUSB212RWBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB212RWBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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