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TUSB212QRWBTQ1

Texas Instruments

TUSB212QRWBTQ1 by Texas Instruments

TUSB212QRWBTQ1 by Texas Instruments is a telecom interface IC with 480.24 Mbps data rate, operating at -40 to 105°C. It features a very thin profile chip carrier package with 12 terminals for industrial applications requiring a 3.3V supply voltage and minimal current consumption of 0.03mA.

Median Price

$4.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 222,112 parts In-Stock

1+ parts

$3.996

100+ parts

$3.501

1k+ parts

$1.978

10k+ parts

-

222,112

$3.996

$3.501

$1.978

-

Mouser Electronics

USA . 10,001 parts In-Stock

1+ parts

$4.850

100+ parts

$3.090

1k+ parts

$2.740

10k+ parts

$2.650

10,001

$4.850

$3.090

$2.740

$2.650

DigiKey

USA . 1,516 parts In-Stock

1+ parts

$4.850

100+ parts

$3.082

1k+ parts

$2.472

10k+ parts

-

1,516

$4.850

$3.082

$2.472

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,581 parts In-Stock

1+ parts

$3.534

100+ parts

-

1k+ parts

-

10k+ parts

-

1,581

$3.534

-

-

-

Vyrian

USA . 2,650 parts In-Stock

1+ parts

$3.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

$3.720

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 5,000 parts In-Stock

1+ parts

$3.348

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

$3.348

-

-

-

Parana Technologies

USA . 2,216 parts In-Stock

1+ parts

$14.296

100+ parts

-

1k+ parts

$14.746

10k+ parts

-

2,216

$14.296

-

$14.746

-

DigiPath Technology Company

USA . 1,700 parts In-Stock

1+ parts

$15.742

100+ parts

$14.482

1k+ parts

-

10k+ parts

-

1,700

$15.742

$14.482

-

-

ChromeModa Solutions

Germany . 1,937 parts In-Stock

1+ parts

$16.063

100+ parts

$13.172

1k+ parts

-

10k+ parts

-

1,937

$16.063

$13.172

-

-

IDEA Electronic Components Group

UK . 807 parts In-Stock

1+ parts

$16.063

100+ parts

$15.260

1k+ parts

$14.457

10k+ parts

-

807

$16.063

$15.260

$14.457

-

Lixinc

USA . 16,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,599

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,261

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Overview

Elevate your telecom interface with the TUSB212QRWBTQ1 by Texas Instruments. Manufactured with precision and quality in mind, this chip carrier boasts a very thin profile, making it ideal for various industrial applications. With a maximum operating temperature of 105° °C and a data rate of 480.24 Mbps, this innovative product ensures reliable performance and efficiency. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your telecom experience today with the TUSB212QRWBTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the product suitable for a variety of operating environments.

Surface Mount: YES

Surface mount capability simplifies the assembly process and reduces overall product size, making it suitable for compact designs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards, making it ideal for designs with limited space.

No. of Terminals: 12

Having 12 terminals provides flexibility in connectivity options, allowing for versatile integration into different systems.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier style with a very thin profile saves space and enables high-density mounting, making it suitable for compact devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance in harsh conditions, expanding the range of potential applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without compromising performance, increasing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal position enables secure connections and efficient signal transmission, enhancing overall product performance.

Maximum Seated Height: 0.4 mm

Low maximum seated height allows for a slim profile and compact design, ideal for space-constrained applications.

Width: 1.6 mm

Narrow width facilitates integration into small devices, offering flexibility in design and compatibility with various form factors.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures proper soldering and assembly, contributing to overall product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure solder joints and strong connections, enhancing product durability and performance.

Length: 1.6 mm

Compact length allows for efficient use of space on PCBs, contributing to smaller product footprint and optimized layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making the product suitable for industrial applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and offers better electrical performance, contributing to a more sustainable and efficient product.

Maximum Supply Current: 0.03 mA

Low maximum supply current helps in reducing power consumption and heat dissipation, improving overall energy efficiency of the product.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, offering reliable and efficient performance in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V ensures compatibility with standard power sources and consistent performance within specified voltage range.

Terminal Pitch: 0.4 mm

Small terminal pitch allows for high-density mounting and precise connections, enhancing signal integrity and overall product performance.

Data Rate: 480.24 Mbps

High data rate of 480.24 Mbps allows for fast and efficient data transmission, making the product suitable for high-speed telecom applications.

Moisture Sensitivity Level (MSL): 2

MSL level of 2 indicates moderate sensitivity to moisture, requiring proper handling and storage but still suitable for a variety of operating environments.

Technical Specifications

Other Function Telecom Interface ICs TUSB212QRWBTQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB212QRWBTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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