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TUSB214IRWBR

Texas Instruments

TUSB214IRWBR by Texas Instruments

TUSB214IRWBR by Texas Instruments is a telecom IC with data rate of 480.24 Mbps, operating at 3.3V. It features a quad terminal position, very thin profile chip carrier package style, and industrial temperature grade suitability. Ideal for telecom interface applications requiring low supply current and high-speed data transmission in compact designs.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 131,391 parts In-Stock

1+ parts

$3.220

100+ parts

$2.821

1k+ parts

$1.594

10k+ parts

-

131,391

$3.220

$2.821

$1.594

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,814 parts In-Stock

1+ parts

$3.059

100+ parts

-

1k+ parts

-

10k+ parts

-

1,814

$3.059

-

-

-

Chip Stock

USA . 46,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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46,600

-

-

-

-

Vyrian

USA . 4,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,285

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 131,322 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

131,322

$2.740

-

-

-

Semicontronic

India . 131,044 parts In-Stock

1+ parts

$2.740

100+ parts

$2.672

1k+ parts

$2.658

10k+ parts

-

131,044

$2.740

$2.672

$2.658

-

Corphita

USA . 4,253 parts In-Stock

1+ parts

$2.898

100+ parts

-

1k+ parts

-

10k+ parts

-

4,253

$2.898

-

-

-

Corohmni

South Africa . 243 parts In-Stock

1+ parts

$3.220

100+ parts

-

1k+ parts

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10k+ parts

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243

$3.220

-

-

-

Parana Technologies

USA . 189 parts In-Stock

1+ parts

$5.527

100+ parts

-

1k+ parts

$6.283

10k+ parts

-

189

$5.527

-

$6.283

-

ChromeModa Solutions

Germany . 4,989 parts In-Stock

1+ parts

$6.210

100+ parts

$5.092

1k+ parts

-

10k+ parts

-

4,989

$6.210

$5.092

-

-

IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$6.210

100+ parts

-

1k+ parts

$5.589

10k+ parts

-

1,872

$6.210

-

$5.589

-

AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$20.140

100+ parts

-

1k+ parts

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10k+ parts

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872

$20.140

-

-

-

Futuretech Components

Singapore . 21,000 parts In-Stock

1+ parts

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100+ parts

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21,000

-

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A-Z Elektronik GmbH

Germany . 18,000 parts In-Stock

1+ parts

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100+ parts

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18,000

-

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Lixinc

USA . 15,023 parts In-Stock

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15,023

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Kepictronics

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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6,000

-

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Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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600

-

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

-

100+ parts

$5.599

1k+ parts

-

10k+ parts

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560

-

$5.599

-

-

iodParts Technologies Inc.

India . 250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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250

-

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-

-

Overview

Discover the innovative TUSB214IRWBR by Texas Instruments, a cutting-edge Telecom Interface IC that guarantees top-notch quality and reliability. With Texas Instruments' renowned reputation for excellence in electronic components, this product is sure to exceed your expectations. Ideal for a wide range of applications in the telecommunications industry, the TUSB214IRWBR offers unparalleled value and benefits to customers seeking high-performance solutions. Upgrade your systems with this state-of-the-art chip carrier, featuring a very thin profile and advanced technology that delivers exceptional results. Trust Texas Instruments to deliver superior products that enhance your projects and streamline your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it ideal for portable telecom devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and costs during production.

Package Shape: SQUARE

The square package shape provides a compact footprint, allowing for space-saving integration in telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can reliably function in a wide range of environmental conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common in many electronic systems, ensuring compatibility with existing power setups.

Data Rate: 480.24 Mbps

The high data rate of 480.24 Mbps allows for fast and efficient data transmission in telecom networks, enhancing overall performance.

Technical Specifications

Other Function Telecom Interface ICs TUSB214IRWBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB214IRWBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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