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TUSB211IRWBT

Texas Instruments

TUSB211IRWBT by Texas Instruments

TUSB211IRWBT by Texas Instruments is a telecom IC with 12 terminals, operating at -40 to 85°C. It has a package style of CHIP CARRIER and is surface mountable. Ideal for telecom circuits, it operates at 3.3V with a compact size of 1.6x1.6mm for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,112 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,112

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Digiode

USA . 2,038 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,038

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 805 parts In-Stock

1+ parts

$4.884

100+ parts

-

1k+ parts

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10k+ parts

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805

$4.884

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-

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Parana Technologies

USA . 178 parts In-Stock

1+ parts

$10.480

100+ parts

-

1k+ parts

$10.991

10k+ parts

-

178

$10.480

-

$10.991

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ChromeModa Solutions

Germany . 6,325 parts In-Stock

1+ parts

$11.775

100+ parts

$9.656

1k+ parts

-

10k+ parts

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6,325

$11.775

$9.656

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IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$11.775

100+ parts

$11.186

1k+ parts

$10.598

10k+ parts

-

905

$11.775

$11.186

$10.598

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One Stop Electronics

USA . 394 parts In-Stock

1+ parts

$449.000

100+ parts

-

1k+ parts

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10k+ parts

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394

$449.000

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Corphita

USA . 2,809 parts In-Stock

1+ parts

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100+ parts

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2,809

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DigiPath Technology Company

USA . 1,135 parts In-Stock

1+ parts

-

100+ parts

$10.616

1k+ parts

-

10k+ parts

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1,135

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$10.616

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Overview

Upgrade your telecom interface with the TUSB211IRWBT by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance and reliability. This versatile chip carrier is perfect for various telecom applications, offering seamless connectivity and enhanced functionality. With a nominal supply voltage of 3.3V and industrial-grade temperature range, this telecom circuit ensures optimal performance in any environment. Trust Texas Instruments to provide exceptional value and innovation for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection, ensuring the product is long-lasting and reliable.

Surface Mount: YES

Surface mount capability makes installation easy and efficient, saving time and effort during production.

Package Shape: SQUARE

Square shape design allows for efficient use of space, making it suitable for compact electronic devices.

No. of Terminals: 12

A higher number of terminals provide more connectivity options, enhancing the versatility of the product.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier style with a very thin profile saves space and offers a sleek design for integration into various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and performance in diverse environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in extreme cold conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections, reducing the risk of signal interference.

Maximum Seated Height: 0.4 mm

Low maximum seated height minimizes the overall profile of the product, making it suitable for slim designs.

Width: 1.6 mm

Compact width dimension enables easy integration into electronic devices with limited space availability.

Length: 1.6 mm

Short length dimension enhances the product's versatility for use in various electronic applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability and performance in harsh operating environments.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making it a sustainable choice.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimal performance and compatibility in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Stable 3.3V supply voltage ensures consistent power delivery for the product's operation.

Terminal Pitch: 0.4 mm

Narrow terminal pitch provides high-density connections, facilitating compact design layouts and efficient signal transmission.

Technical Specifications

Other Function Telecom Interface ICs TUSB211IRWBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N12

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

1.6 mm

Trade Compliance

TUSB211IRWBT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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