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TUSB212RWBT

Texas Instruments

TUSB212RWBT by Texas Instruments

TUSB212RWBT by Texas Instruments is a telecom interface IC with 12 terminals, operating at 3.3V and supporting data rates up to 480.24 Mbps. It comes in a square chip carrier package with very thin profile, suitable for commercial temperature grade applications requiring low supply current of 0.03 mA.

Median Price

$3.093

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 197 parts In-Stock

1+ parts

$2.740

100+ parts

$1.960

1k+ parts

$1.370

10k+ parts

-

197

$2.740

$1.960

$1.370

-

Texas Instruments

USA . 169,763 parts In-Stock

1+ parts

$3.093

100+ parts

$2.710

1k+ parts

$1.531

10k+ parts

-

169,763

$3.093

$2.710

$1.531

-

Mouser Electronics

USA . 6,475 parts In-Stock

1+ parts

$5.360

100+ parts

$3.020

1k+ parts

$2.120

10k+ parts

$2.060

6,475

$5.360

$3.020

$2.120

$2.060

Element14

Singapore . 197 parts In-Stock

1+ parts

$5.860

100+ parts

$4.310

1k+ parts

$3.090

10k+ parts

-

197

$5.860

$4.310

$3.090

-

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.177

10k+ parts

$2.088

500

-

-

$2.177

$2.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,973 parts In-Stock

1+ parts

$2.603

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

$2.603

-

-

-

Vyrian

USA . 3,810 parts In-Stock

1+ parts

$2.740

100+ parts

-

1k+ parts

-

10k+ parts

-

3,810

$2.740

-

-

-

Chip Stock

USA . 68,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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68,930

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,899 parts In-Stock

1+ parts

$2.466

100+ parts

-

1k+ parts

-

10k+ parts

-

4,899

$2.466

-

-

-

Component Stockers USA

USA . 11,966 parts In-Stock

1+ parts

$2.620

100+ parts

$2.490

1k+ parts

$1.860

10k+ parts

-

11,966

$2.620

$2.490

$1.860

-

Continental Prestige Electronics

USA . 197 parts In-Stock

1+ parts

$2.740

100+ parts

$1.960

1k+ parts

$1.370

10k+ parts

-

197

$2.740

$1.960

$1.370

-

Parana Technologies

USA . 2,324 parts In-Stock

1+ parts

$11.686

100+ parts

$1,085.194

1k+ parts

$10.517

10k+ parts

-

2,324

$11.686

$1,085.194

$10.517

-

DigiPath Technology Company

USA . 559 parts In-Stock

1+ parts

$12.867

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$12.867

-

-

-

ChromeModa Solutions

Germany . 3,699 parts In-Stock

1+ parts

$13.130

100+ parts

$10.767

1k+ parts

-

10k+ parts

-

3,699

$13.130

$10.767

-

-

IDEA Electronic Components Group

UK . 1,705 parts In-Stock

1+ parts

$13.130

100+ parts

$12.474

1k+ parts

$11.817

10k+ parts

-

1,705

$13.130

$12.474

$11.817

-

Lixinc

USA . 8,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,249

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,889

-

-

-

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Alle Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Overview

Experience seamless connectivity and reliable performance with the TUSB212RWBT by Texas Instruments. This innovative product is crafted with precision and expertise, guaranteeing top-notch quality and durability. Ideal for various applications in the telecom industry, this Telecom Interface IC ensures a smooth and efficient operation. With its cutting-edge technology and superior design, customers can trust in the value, benefits, and advantages that the TUSB212RWBT brings to their projects. Choose Texas Instruments for unmatched excellence and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, saving time and effort during manufacturing.

No. of Terminals: 12

Having 12 terminals enables versatile connectivity options and functionality in the product.

Maximum Operating Temperature: 70 °C

Ability to operate at a maximum temperature of 70°C ensures stability and reliability even under high temperature conditions.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3V makes this product compatible with a wide range of systems and applications.

Data Rate: 480.24 Mbps

High data rate of 480.24 Mbps ensures fast and efficient data transfer, ideal for telecom applications that require high-speed communication.

Technical Specifications

Other Function Telecom Interface ICs TUSB212RWBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB212RWBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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