Loading...

TUSB214RWBR

Texas Instruments

TUSB214RWBR by Texas Instruments

TUSB214RWBR by Texas Instruments is a 12-terminal telecom IC with a data rate of 4 Mbps, operating at 3.3V. It features a peak reflow temperature of 260°C and is suitable for telecom circuit applications due to its very thin profile chip carrier package style.

Median Price

$2.785

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,229 parts In-Stock

1+ parts

$2.770

100+ parts

$2.160

1k+ parts

$1.570

10k+ parts

$1.490

2,229

$2.770

$2.160

$1.570

$1.490

Texas Instruments

USA . 91,738 parts In-Stock

1+ parts

$2.800

100+ parts

$2.453

1k+ parts

$1.386

10k+ parts

-

91,738

$2.800

$2.453

$1.386

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 720 parts In-Stock

1+ parts

$2.546

100+ parts

-

1k+ parts

-

10k+ parts

-

720

$2.546

-

-

-

Vyrian

USA . 2,723 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,723

$2.680

-

-

-

Component Sense

UK . 1,072 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,072

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 502 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

-

10k+ parts

-

502

$2.412

-

-

-

Parana Technologies

USA . 146 parts In-Stock

1+ parts

$15.291

100+ parts

-

1k+ parts

$15.684

10k+ parts

-

146

$15.291

-

$15.684

-

IDEA Electronic Components Group

UK . 2,307 parts In-Stock

1+ parts

$17.181

100+ parts

$16.322

1k+ parts

$15.463

10k+ parts

-

2,307

$17.181

$16.322

$15.463

-

ChromeModa Solutions

Germany . 1,438 parts In-Stock

1+ parts

$17.181

100+ parts

$14.088

1k+ parts

-

10k+ parts

-

1,438

$17.181

$14.088

-

-

A-Z Elektronik GmbH

Germany . 15,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,750

-

-

-

-

Kepictronics

USA . 7,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,400

-

-

-

-

Lixinc

USA . 7,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,397

-

-

-

-

DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

-

100+ parts

$15.490

1k+ parts

-

10k+ parts

-

1,837

-

$15.490

-

-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unlock seamless communication with the TUSB214RWBR from Texas Instruments. Crafted with precision and expertise, this telecom interface IC promises superior quality and reliability. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers. Experience the advantage of smooth data transmission and enhanced connectivity with the TUSB214RWBR. Trust in Texas Instruments for cutting-edge solutions that elevate your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, increasing its longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape is commonly used in telecom applications and provides good heat dissipation and efficient layout design.

No. of Terminals: 12

Having 12 terminals allows for sufficient connectivity options for the IC, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

Operating temperature up to 70°C ensures the IC can perform reliably in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the IC can be used in both cold and hot climates, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections.

Maximum Supply Current: 0.03 mA

Low maximum supply current of 0.03 mA ensures efficient power usage and conserves energy for the overall system.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V is commonly used in telecom applications, ensuring compatibility with standard power sources.

Data Rate: 4 Mbps

Data rate of 4 Mbps allows for fast and efficient data transfer in telecom applications, improving overall performance.

Technical Specifications

Other Function Telecom Interface ICs TUSB214RWBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB214RWBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 16