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TUSB211QRWBRQ1

Texas Instruments

TUSB211QRWBRQ1 by Texas Instruments

TUSB211QRWBRQ1 by Texas Instruments is a telecom interface IC with 480 Mbps data rate, operating at -40 to 105°C. It features a 3.3V supply voltage, quad terminals, and nickel palladium gold finish. Ideal for industrial applications requiring low supply current of 0.02 mA in a compact chip carrier package.

Median Price

$2.820

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,900 parts In-Stock

1+ parts

$3.770

100+ parts

$2.360

1k+ parts

$2.105

10k+ parts

$2.031

1,900

$3.770

$2.360

$2.105

$2.031

Mouser Electronics

USA . 15,674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.870

15,674

-

-

-

$1.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 3,000 parts In-Stock

1+ parts

$1.971

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

$1.971

-

-

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Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$2.167

100+ parts

-

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37

$2.167

-

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Digiode

USA . 4,096 parts In-Stock

1+ parts

$5.054

100+ parts

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4,096

$5.054

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Chip Stock

USA . 72,500 parts In-Stock

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72,500

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Vyrian

USA . 8,329 parts In-Stock

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8,329

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Cyclops Electronics Ltd

UK . 6,116 parts In-Stock

1+ parts

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6,116

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TME

Poland . 3,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$2.400

3,000

-

-

-

$2.400

NAC Semi

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$6.090

1k+ parts

-

10k+ parts

$5.630

2,400

-

$6.090

-

$5.630

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,578 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

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10k+ parts

-

8,578

$1.590

-

-

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Semicontronic

India . 8,564 parts In-Stock

1+ parts

$1.590

100+ parts

$1.550

1k+ parts

$1.542

10k+ parts

-

8,564

$1.590

$1.550

$1.542

-

Continental Prestige Electronics

USA . 1,505 parts In-Stock

1+ parts

$2.167

100+ parts

-

1k+ parts

-

10k+ parts

$2.124

1,505

$2.167

-

-

$2.124

Argo Parts USA

USA . 577 parts In-Stock

1+ parts

$2.167

100+ parts

-

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577

$2.167

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Corphita

USA . 3,067 parts In-Stock

1+ parts

$4.788

100+ parts

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3,067

$4.788

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Parana Technologies

USA . 1,503 parts In-Stock

1+ parts

$8.499

100+ parts

-

1k+ parts

$9.153

10k+ parts

-

1,503

$8.499

-

$9.153

-

DigiPath Technology Company

USA . 2,007 parts In-Stock

1+ parts

$9.358

100+ parts

-

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2,007

$9.358

-

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ChromeModa Solutions

Germany . 4,739 parts In-Stock

1+ parts

$9.549

100+ parts

$7.830

1k+ parts

-

10k+ parts

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4,739

$9.549

$7.830

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IDEA Electronic Components Group

UK . 1,327 parts In-Stock

1+ parts

$9.549

100+ parts

$9.072

1k+ parts

$8.594

10k+ parts

-

1,327

$9.549

$9.072

$8.594

-

Microchip USA

USA . 202 parts In-Stock

1+ parts

$13.060

100+ parts

$12.980

1k+ parts

$12.940

10k+ parts

$12.900

202

$13.060

$12.980

$12.940

$12.900

GreenTree Electronics

Israel . 48,000 parts In-Stock

1+ parts

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48,000

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A-Z Elektronik GmbH

Germany . 12,440 parts In-Stock

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12,440

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Lixinc

USA . 1,617 parts In-Stock

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1,617

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Perfect Parts

USA . 1,595 parts In-Stock

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1,595

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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Overview

Experience seamless communication with the TUSB211QRWBRQ1 from Texas Instruments, a leading manufacturer known for its top-notch quality and reliability. This telecom interface IC offers unparalleled performance in various applications, ensuring fast and efficient data transfer at 480 Mbps. With a wide temperature range and compact chip carrier package, this product is ideal for industrial use. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs, providing value and innovation in every interaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various telecom applications.

Surface Mount: YES

This feature allows for easy and quick installation on circuit boards, saving time and effort in manufacturing processes.

Screening Level: AEC-Q100

With this level of screening, the product meets automotive industry standards for reliability and performance under harsh conditions.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board and enabling high-density layouts.

No. of Terminals: 12

This number of terminals allows for flexibility in connectivity options, making it versatile for different telecom interface requirements.

Package Style: CHIP CARRIER, VERY THIN PROFILE

This style of package offers a low profile design, ideal for space-constrained applications while maintaining performance.

Maximum Operating Temperature: 105 °C

The high operating temperature range ensures the product can operate efficiently in various environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low operating temperature range allows the product to function reliably even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the overall reliability and longevity of the product.

Terminal Position: QUAD

The quad terminal position layout facilitates efficient connection and soldering, optimizing manufacturing processes and reducing assembly time.

Maximum Seated Height: 0.4 mm

The low seated height contributes to a compact and slim design, ideal for applications where space is limited.

Width: 1.6 mm

The narrow width of the product allows for efficient use of board space, enabling high-density integration in telecom systems.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time reduces the risk of thermal damage during assembly, ensuring the product's reliability and longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without compromising performance.

Length: 1.6 mm

The compact length of the product contributes to a space-saving design, ideal for applications where board real estate is limited.

Temperature Grade: INDUSTRIAL

This industrial temperature grade rating ensures the product's suitability for rugged telecom environments with varying temperature conditions.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and industry standards, making it an eco-friendly choice for telecom applications.

Maximum Supply Current: 0.02 mA

The low supply current requirement minimizes power consumption, making the product energy-efficient and cost-effective in telecom systems.

Telecom IC Type: TELECOM CIRCUIT

This specific IC type is designed for telecom applications, ensuring optimal performance and compatibility with telecom systems.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in telecom systems, ensuring compatibility with existing power sources.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for a high-density layout on the circuit board, enabling efficient use of space in telecom applications.

Data Rate: 480 Mbps

The high data rate capability of 480 Mbps ensures fast and reliable data transmission in telecom interfaces, meeting the demands of modern communication systems.

Moisture Sensitivity Level (MSL): 2

This MSL level indicates the product's resistance to moisture-induced damage during storage and handling, ensuring long-term reliability in telecom environments.

Technical Specifications

Other Function Telecom Interface ICs TUSB211QRWBRQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.02 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB211QRWBRQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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