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TUSB214IRWBT

Texas Instruments

TUSB214IRWBT by Texas Instruments

TUSB214IRWBT by Texas Instruments is a telecom IC with data rate of 480.24 Mbps, operating at 3.3V. It features a quad terminal position in a chip carrier package style, suitable for industrial applications requiring low supply current and high-speed data transmission.

Median Price

$4.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 141 parts In-Stock

1+ parts

$3.720

100+ parts

$2.660

1k+ parts

$1.860

10k+ parts

-

141

$3.720

$2.660

$1.860

-

Texas Instruments

USA . 226,594 parts In-Stock

1+ parts

$3.779

100+ parts

$3.312

1k+ parts

$1.871

10k+ parts

-

226,594

$3.779

$3.312

$1.871

-

DigiKey

USA . 836 parts In-Stock

1+ parts

$4.610

100+ parts

$2.922

1k+ parts

$2.646

10k+ parts

$2.541

836

$4.610

$2.922

$2.646

$2.541

Mouser Electronics

USA . 334 parts In-Stock

1+ parts

$4.610

100+ parts

$2.930

1k+ parts

$2.560

10k+ parts

$2.540

334

$4.610

$2.930

$2.560

$2.540

Element14

Singapore . 141 parts In-Stock

1+ parts

$7.990

100+ parts

$5.880

1k+ parts

$4.220

10k+ parts

$4.010

141

$7.990

$5.880

$4.220

$4.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 767 parts In-Stock

1+ parts

$3.590

100+ parts

-

1k+ parts

-

10k+ parts

-

767

$3.590

-

-

-

Vyrian

USA . 98 parts In-Stock

1+ parts

$3.779

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$3.779

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 75,707 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

-

10k+ parts

-

75,707

$3.210

-

-

-

Semicontronic

India . 75,638 parts In-Stock

1+ parts

$3.210

100+ parts

$3.130

1k+ parts

$3.114

10k+ parts

-

75,638

$3.210

$3.130

$3.114

-

Corphita

USA . 2,073 parts In-Stock

1+ parts

$3.401

100+ parts

-

1k+ parts

-

10k+ parts

-

2,073

$3.401

-

-

-

Corohmni

South Africa . 490 parts In-Stock

1+ parts

$3.779

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$3.779

-

-

-

Component Stockers USA

USA . 1,301 parts In-Stock

1+ parts

$4.890

100+ parts

$3.600

1k+ parts

-

10k+ parts

-

1,301

$4.890

$3.600

-

-

Parana Technologies

USA . 495 parts In-Stock

1+ parts

$16.010

100+ parts

-

1k+ parts

$16.353

10k+ parts

-

495

$16.010

-

$16.353

-

DigiPath Technology Company

USA . 2,178 parts In-Stock

1+ parts

$17.629

100+ parts

$16.219

1k+ parts

-

10k+ parts

-

2,178

$17.629

$16.219

-

-

IDEA Electronic Components Group

UK . 1,544 parts In-Stock

1+ parts

$17.989

100+ parts

$17.090

1k+ parts

$16.190

10k+ parts

-

1,544

$17.989

$17.090

$16.190

-

ChromeModa Solutions

Germany . 1,309 parts In-Stock

1+ parts

$17.989

100+ parts

$14.751

1k+ parts

-

10k+ parts

-

1,309

$17.989

$14.751

-

-

Lixinc

USA . 14,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,592

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,837 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,837

-

-

-

-

Overview

Upgrade your telecom interface systems with the TUSB214IRWBT by Texas Instruments. Manufactured by a trusted industry leader, this high-quality chip carrier offers reliable performance in a compact square package. Ideal for various applications, this telecom IC provides fast data rates and low supply current, ensuring efficient operation. With a wide temperature range and moisture sensitivity level of 2, customers can trust in the durability and longevity of this innovative product. Invest in the TUSB214IRWBT today for seamless connectivity and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology makes for easier and more cost-effective assembly, saving time and resources.

Maximum Operating Temperature: 85 °C

This high operating temperature range allows the IC to function in various industrial settings without overheating.

Nominal Supply Voltage: 3.3 V

Compatible with standard supply voltages, making it easy to integrate into existing systems.

Data Rate: 480.24 Mbps

High data rate capability enables fast and efficient communication, ideal for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs TUSB214IRWBT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

480.24 Mbps

JESD-30 Code:

S-PQCC-N12

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Maximum Supply Current:

.03 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TUSB214IRWBT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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