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TRF370315IRGETG4

Texas Instruments

TRF370315IRGETG4 by Texas Instruments

TRF370315IRGETG4 by Texas Instruments is a 24-terminal IC with 5V supply voltage, operating b/w -40 to 85°C. It features nickel palladium gold finish and is surface mountable. Ideal for industrial applications requiring telecom interface functions in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,686 parts In-Stock

1+ parts

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4,686

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Vyrian

USA . 2,128 parts In-Stock

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2,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$14.863

100+ parts

-

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215

$14.863

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Parana Technologies

USA . 1,386 parts In-Stock

1+ parts

$15.487

100+ parts

-

1k+ parts

$15.865

10k+ parts

-

1,386

$15.487

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$15.865

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DigiPath Technology Company

USA . 982 parts In-Stock

1+ parts

$17.053

100+ parts

$15.689

1k+ parts

-

10k+ parts

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982

$17.053

$15.689

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ChromeModa Solutions

Germany . 1,106 parts In-Stock

1+ parts

$17.401

100+ parts

$14.269

1k+ parts

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1,106

$17.401

$14.269

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IDEA Electronic Components Group

UK . 830 parts In-Stock

1+ parts

$17.401

100+ parts

$16.531

1k+ parts

$15.661

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830

$17.401

$16.531

$15.661

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One Stop Electronics

USA . 268 parts In-Stock

1+ parts

$345.000

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268

$345.000

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Corphita

USA . 2,114 parts In-Stock

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2,114

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Overview

Upgrade your telecommunications systems with the TRF370315IRGETG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This innovative telecom interface IC is versatile and reliable, offering seamless integration into a variety of applications. With its high-performance capabilities and durable design, this product ensures optimal functionality and efficiency for your projects. Experience superior value and performance with the TRF370315IRGETG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring long-term reliability.

Surface Mount: YES

Easier and more efficient assembly process compared to through-hole mounting.

Package Shape: SQUARE

Compact shape allowing for efficient use of space on PCB.

Power Supplies (V): 5

Standard power supply voltage for compatibility with existing systems.

No. of Terminals: 24

Sufficient number of terminals for connecting to various components and interfaces.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides good thermal and electrical performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for versatility in different environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without risk of damage.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for enhanced conductivity and corrosion resistance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process without overheating.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for robust performance in harsh conditions.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board designs and space-saving.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level ensuring safe storage and handling.

Technical Specifications

Other Function Telecom Interface ICs TRF370315IRGETG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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