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TRF3020PT

Texas Instruments

TRF3020PT by Texas Instruments

TRF3020PT by Texas Instruments is a telecom IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 3.75V and terminal pitch of 0.5mm. Ideal for telecom applications due to its low profile flatpack design and industrial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,434 parts In-Stock

1+ parts

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6,434

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Digiode

USA . 1,616 parts In-Stock

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1,616

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 640 parts In-Stock

1+ parts

$6.781

100+ parts

-

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640

$6.781

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Parana Technologies

USA . 1,983 parts In-Stock

1+ parts

$10.626

100+ parts

-

1k+ parts

$11.119

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1,983

$10.626

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$11.119

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DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$11.700

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820

$11.700

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IDEA Electronic Components Group

UK . 2,242 parts In-Stock

1+ parts

$11.939

100+ parts

$11.342

1k+ parts

$10.745

10k+ parts

-

2,242

$11.939

$11.342

$10.745

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ChromeModa Solutions

Germany . 73 parts In-Stock

1+ parts

$11.939

100+ parts

$9.790

1k+ parts

-

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73

$11.939

$9.790

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One Stop Electronics

USA . 869 parts In-Stock

1+ parts

$725.000

100+ parts

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869

$725.000

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Corphita

USA . 4,255 parts In-Stock

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4,255

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Overview

Unlock the potential of your telecom systems with the TRF3020PT by Texas Instruments. Manufactured to the highest standards, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides superior performance and efficiency. Experience seamless integration, increased productivity, and enhanced functionality with the TRF3020PT. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your telecom systems with the TRF3020PT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in telecommunications applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, making it suitable for compact designs.

Power Supplies (V): 3.75

The power supply voltage of 3.75V is commonly used in telecommunications applications, ensuring compatibility with existing systems.

No. of Terminals: 48

Having 48 terminals provides flexibility in connectivity options, allowing for a wide range of interfacing possibilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures space-saving, high-density integration on the PCB, ideal for telecom applications with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to operate reliably in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position provides enhanced stability and secure connection to the PCB, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 1.45 mm

The low maximum seated height allows for a slim profile design, making it suitable for applications where space is a constraint.

Width: 5.5 mm

The compact width of 5.5mm helps in achieving a smaller footprint on the PCB, enabling efficient use of space.

Length: 5.5 mm

The length of 5.5mm contributes to the compactness of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making it suitable for industrial telecom applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical robustness and ease of soldering during assembly, ensuring long-term reliability.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product offers optimized performance and compatibility with telecom systems.

Nominal Supply Voltage: 3.75 V

The nominal supply voltage of 3.75V is standard for telecom applications, ensuring seamless integration into existing systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density packing of terminals on the PCB, enhancing connectivity options.

Technical Specifications

Other Function Telecom Interface ICs TRF3020PT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G48

Length:

5.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.75

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.5 mm

Trade Compliance

TRF3020PT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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