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AD9363ABCZ

Analog Devices

AD9363ABCZ by Analog Devices

AD9363ABCZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features a low profile design and ball terminal form.

Median Price

$164.760

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 4 parts In-Stock

1+ parts

$124.240

100+ parts

$112.710

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-

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4

$124.240

$112.710

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Chip1Stop

Japan . 5 parts In-Stock

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$148.000

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5

$148.000

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Analog Devices Inc

USA . 5 parts In-Stock

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$172.950

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$118.130

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5

$172.950

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$118.130

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Verical

USA . 1 parts In-Stock

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$174.733

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1

$174.733

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Mouser Electronics

USA . 14 parts In-Stock

1+ parts

$196.550

100+ parts

$164.930

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14

$196.550

$164.930

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DigiKey

USA . 164 parts In-Stock

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164

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Richardson RFPD

USA . 60 parts In-Stock

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$156.570

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60

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$156.570

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Arrow

USA . 1 parts In-Stock

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1

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Distributors (In-Stock)

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Digiode

USA . 909 parts In-Stock

1+ parts

$118.028

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909

$118.028

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$154.070

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150

$154.070

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Chip Stock

USA . 4,538 parts In-Stock

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Vyrian

USA . 4,512 parts In-Stock

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VNN

France . 1,949 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 541 parts In-Stock

1+ parts

$6.939

100+ parts

-

1k+ parts

$6.453

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541

$6.939

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$6.453

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$7.461

100+ parts

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$7.088

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188

$7.461

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$7.088

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Aztec Data Supply Inc.

USA . 7,070 parts In-Stock

1+ parts

$9.520

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7,070

$9.520

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DigiPath Technology Company

USA . 99 parts In-Stock

1+ parts

$11.639

100+ parts

$11.174

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$11.174

99

$11.639

$11.174

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$11.174

AZTECH Wire

Italy . 561 parts In-Stock

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$15.738

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561

$15.738

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Semicontronic

India . 113 parts In-Stock

1+ parts

$105.600

100+ parts

$102.960

1k+ parts

$102.432

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113

$105.600

$102.960

$102.432

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Corphita

USA . 164 parts In-Stock

1+ parts

$111.816

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164

$111.816

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Continental Prestige Electronics

USA . 4 parts In-Stock

1+ parts

$134.280

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$120.530

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4

$134.280

$120.530

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Modulus Dynamics

Lithuania . 1,539 parts In-Stock

1+ parts

$136.800

100+ parts

$136.800

1k+ parts

$136.800

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1,539

$136.800

$136.800

$136.800

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Corohmni

South Africa . 411 parts In-Stock

1+ parts

$136.800

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411

$136.800

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Advanced Electronics

New Zealand . 1,862 parts In-Stock

1+ parts

$140.904

100+ parts

$133.859

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$133.859

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1,862

$140.904

$133.859

$133.859

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Netroflash

USA . 100 parts In-Stock

1+ parts

$154.070

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100

$154.070

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Ampacity Inc.

Singapore . 113 parts In-Stock

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$229.840

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113

$229.840

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Argo Parts USA

USA . 4,767 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,244 parts In-Stock

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Lixinc

USA . 2,015 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Overview

Revolutionize your telecom interface systems with the AD9363ABCZ by Analog Devices. As a leading manufacturer in the industry, Analog Devices guarantees top-notch quality and performance. This versatile telecom circuit IC is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Say goodbye to limitations and hello to seamless connectivity with the AD9363ABCZ. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making the product suitable for various operating conditions.

Surface Mount: YES

With surface mount capability, this product offers easy and efficient installation for seamless integration into electronic devices.

Package Shape: SQUARE

The square package shape ensures efficient use of space on circuit boards, maximizing design flexibility.

No. of Terminals: 144

With a high number of terminals, this product offers extensive connectivity options for complex telecom applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with precise terminal spacing, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.7 mm

With a low seated height, this product helps conserve space in electronic designs, allowing for more compact devices.

Width: 10 mm

The moderate width of the product ensures compatibility with standard PCB layouts, offering easy integration into existing designs.

Maximum Time At Peak Reflow Temperature: 30s

The short time at peak reflow temperature minimizes thermal stress on the components during manufacturing, ensuring long-term reliability.

Peak Reflow Temperature: 260C

The high peak reflow temperature tolerance allows for efficient soldering processes, ensuring secure connections for robust performance.

Length: 10 mm

The length of the product is optimized for space efficiency, ideal for compact electronic devices and high-density PCB designs.

Temperature Grade: INDUSTRIAL

This temperature grade indicates that the product is suitable for industrial applications with extended temperature ranges and reliability requirements.

Terminal Form: BALL

The ball terminal form offers reliable contact points and facilitates accurate soldering, ensuring stable connections in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

This telecom IC type is specifically designed for telecom applications, providing specialized functionalities tailored to the industry's requirements.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3V ensures compatibility with standard power sources, making integration into existing systems seamless.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8mm allows for high-density mounting, enabling complex circuit designs in a compact footprint.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has a moderate moisture sensitivity, making it suitable for a wide range of storage and operating conditions.

Technical Specifications

Other Function Telecom Interface ICs AD9363ABCZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.7 mm

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD9363ABCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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