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TLK2521IPAPR

Texas Instruments

TLK2521IPAPR by Texas Instruments

TLK2521IPAPR by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and uses CMOS technology. The package is a square flatpack with thin profile, suitable for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,065 parts In-Stock

1+ parts

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6,065

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Digiode

USA . 4,258 parts In-Stock

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4,258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 585 parts In-Stock

1+ parts

$7.324

100+ parts

-

1k+ parts

$7.815

10k+ parts

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585

$7.324

-

$7.815

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DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$8.064

100+ parts

$7.419

1k+ parts

-

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766

$8.064

$7.419

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ChromeModa Solutions

Germany . 4,228 parts In-Stock

1+ parts

$8.229

100+ parts

$6.748

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-

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4,228

$8.229

$6.748

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IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$8.229

100+ parts

-

1k+ parts

$7.406

10k+ parts

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2,227

$8.229

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$7.406

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$17.926

100+ parts

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405

$17.926

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One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$132.000

100+ parts

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471

$132.000

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Corphita

USA . 3,445 parts In-Stock

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3,445

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Overview

Experience seamless communication with the TLK2521IPAPR by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Designed for a wide range of applications, this product provides customers with the value and benefits they need for their projects. Trust in Texas Instruments to deliver cutting-edge technology that enhances your communication systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability makes installation and assembly easier and more efficient.

Package Shape: SQUARE

Square package shape allows for easy integration into various electronic devices.

Power Supplies (V): 2.5

Stable power supply of 2.5V ensures consistent performance of the IC.

No. of Terminals: 64

With 64 terminals, this IC has multiple connection points for enhanced functionality.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style allows for compact design and space-saving.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

Operating down to -40°C ensures functionality even in low temperature conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for slim and compact device designs.

Width: 10 mm

10mm width provides compatibility and ease of integration in various applications.

Length: 10 mm

10mm length ensures a compact footprint for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and ease of soldering.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimized performance in communication applications.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V is ideal for telecom applications requiring stable power.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high density mounting and compact design.

Technical Specifications

Other Function Telecom Interface ICs TLK2521IPAPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TLK2521IPAPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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