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TLK2501IRCP

Texas Instruments

TLK2501IRCP by Texas Instruments

TLK2501IRCP by Texas Instruments is a telecom IC with 2.5V supply voltage and 2500 Mbps data rate. It features a 64-terminal package with nickel palladium gold finish, suitable for industrial applications requiring high-speed communication in temperature range of -40 to 85°C. The compact square-shaped IC is surface mountable and has a low profile design ideal for space-constrained environments.

Median Price

$23.981

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 4 parts In-Stock

1+ parts

$23.830

100+ parts

$18.880

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4

$23.830

$18.880

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Chip1Stop

Japan . 108 parts In-Stock

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$24.000

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$19.400

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$24.000

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Texas Instruments

USA . 20,463 parts In-Stock

1+ parts

$24.369

100+ parts

$21.286

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$14.680

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20,463

$24.369

$21.286

$14.680

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DigiKey

USA . 255 parts In-Stock

1+ parts

$33.530

100+ parts

$25.617

1k+ parts

$22.861

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255

$33.530

$25.617

$22.861

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Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$33.530

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$25.620

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130

$33.530

$25.620

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Verical

USA . 800 parts In-Stock

1+ parts

-

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$23.962

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$21.663

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800

-

$23.962

$21.663

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Avnet

USA . 37 parts In-Stock

1+ parts

-

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$19.144

10k+ parts

$18.616

37

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-

$19.144

$18.616

Rochester

USA . 27 parts In-Stock

1+ parts

-

100+ parts

$20.720

1k+ parts

$18.540

10k+ parts

$17.450

27

-

$20.720

$18.540

$17.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 109 parts In-Stock

1+ parts

$19.229

100+ parts

$17.010

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-

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109

$19.229

$17.010

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Digiode

USA . 2,030 parts In-Stock

1+ parts

$19.370

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-

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2,030

$19.370

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Vyrian

USA . 256 parts In-Stock

1+ parts

$20.390

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256

$20.390

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Dan-Mar Components

USA . 108 parts In-Stock

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108

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Atlantic Semiconductor

USA . 36 parts In-Stock

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36

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Zilex Electronics Inc.

Canada . 12 parts In-Stock

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QIE Inc.

USA . 6 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Legend Electronics Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,094 parts In-Stock

1+ parts

$7.600

100+ parts

-

1k+ parts

$8.111

10k+ parts

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2,094

$7.600

-

$8.111

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DigiPath Technology Company

USA . 146 parts In-Stock

1+ parts

$8.368

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146

$8.368

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ChromeModa Solutions

Germany . 5,519 parts In-Stock

1+ parts

$8.539

100+ parts

$7.002

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5,519

$8.539

$7.002

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IDEA Electronic Components Group

UK . 662 parts In-Stock

1+ parts

$8.539

100+ parts

$8.112

1k+ parts

$7.685

10k+ parts

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662

$8.539

$8.112

$7.685

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Corohmni

South Africa . 941 parts In-Stock

1+ parts

$8.557

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941

$8.557

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Modulus Dynamics

Lithuania . 4,433 parts In-Stock

1+ parts

$14.362

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$14.362

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$14.362

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4,433

$14.362

$14.362

$14.362

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Corphita

USA . 416 parts In-Stock

1+ parts

$18.351

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416

$18.351

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Ampacity Inc.

Singapore . 4,433 parts In-Stock

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$37.720

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4,433

$37.720

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Argo Parts USA

USA . 3,090 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Lixinc

USA . 1,482 parts In-Stock

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1,482

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Continental Prestige Electronics

USA . 851 parts In-Stock

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Kepictronics

USA . 233 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 160 parts In-Stock

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160

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Overview

Experience seamless communication and high-speed data transmission with the TLK2501IRCP by Texas Instruments. As a leader in innovative technology solutions, Texas Instruments delivers top-quality products that are trusted by industry professionals worldwide. The TLK2501IRCP falls under the category of Other Function Telecom Interface ICs, offering a reliable and efficient solution for various telecom applications. With a focus on performance and precision, this product provides customers with unparalleled value and benefits, making it an essential component for any communication system. Trust Texas Instruments to elevate your connectivity experience with the TLK2501IRCP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it ideal for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enhancing reliability.

Power Supplies (V): 2.5

The 2.5V power supply ensures compatibility with standard telecom voltage requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can perform reliably in a variety of environments.

Data Rate: 2500 Mbps

The high data rate of 2500 Mbps allows for fast and efficient telecom data transmission.

Technical Specifications

Other Function Telecom Interface ICs TLK2501IRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2500 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2501IRCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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