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TLK2701IRCPG4

Texas Instruments

TLK2701IRCPG4 by Texas Instruments

TLK2701IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm. This quad-terminal IC is ideal for telecom circuit applications due to its industrial temperature grade and moisture sensitivity level of 3.

Median Price

$18.460

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 866 parts In-Stock

1+ parts

$18.460

100+ parts

$18.090

1k+ parts

$17.720

10k+ parts

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866

$18.460

$18.090

$17.720

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Distributors (In-Stock)

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Vyrian

USA . 2,054 parts In-Stock

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2,054

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Digiode

USA . 2,036 parts In-Stock

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2,036

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Next Level Components, LLC

USA . 226 parts In-Stock

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226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,771 parts In-Stock

1+ parts

$5.848

100+ parts

-

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$6.630

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1,771

$5.848

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$6.630

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$6.440

100+ parts

$5.924

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1,126

$6.440

$5.924

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ChromeModa Solutions

Germany . 6,810 parts In-Stock

1+ parts

$6.571

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$5.388

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6,810

$6.571

$5.388

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

1+ parts

$6.571

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$5.914

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2,039

$6.571

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$5.914

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AZTECH Wire

Italy . 563 parts In-Stock

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$16.216

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563

$16.216

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Component Stockers USA

USA . 628 parts In-Stock

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$99.990

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628

$99.990

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One Stop Electronics

USA . 816 parts In-Stock

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$751.000

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816

$751.000

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Corphita

USA . 2,546 parts In-Stock

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2,546

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Microchip USA

USA . 371 parts In-Stock

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371

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Overview

Upgrade your telecom interfaces with the TLK2701IRCPG4 by Texas Instruments. Crafted with precision and expertise, this high-quality IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product not only delivers superior connectivity but also ensures seamless communication. With its advanced features and innovative design, the TLK2701IRCPG4 provides customers with exceptional value and benefits, making it the perfect choice for all your telecom interface needs. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient board assembly, saving time and cost.

Power Supplies (V): 2.5

Operates on a low voltage supply, which can help in reducing power consumption and heat generation.

No. of Terminals: 64

The high number of terminals allows for multiple connections and functionality in a compact design.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments, increasing overall reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term performance.

Width: 10 mm

Compact width makes the product suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during manufacturing processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can withstand harsh environmental conditions.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has moderate sensitivity to moisture, suitable for standard assembly processes.

Technical Specifications

Other Function Telecom Interface ICs TLK2701IRCPG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2701IRCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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