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TLK2501IRCPG4

Texas Instruments

TLK2501IRCPG4 by Texas Instruments

TLK2501IRCPG4 by Texas Instruments is a 64-terminal IC with 2.5V supply voltage, operating at -40 to 85°C. It offers data rate of 2500 Mbps and features GULL WING terminals for telecom circuits. This square-shaped IC in PLASTIC/EPOXY package is ideal for high-speed communication applications.

Median Price

$20.720

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$20.720

1k+ parts

$18.540

10k+ parts

$17.450

4

-

$20.720

$18.540

$17.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,866 parts In-Stock

1+ parts

$19.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,866

$19.370

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-

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Vyrian

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

3,475

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,593 parts In-Stock

1+ parts

$7.074

100+ parts

$656.902

1k+ parts

$6.366

10k+ parts

-

1,593

$7.074

$656.902

$6.366

-

DigiPath Technology Company

USA . 226 parts In-Stock

1+ parts

$7.789

100+ parts

$7.166

1k+ parts

-

10k+ parts

-

226

$7.789

$7.166

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-

ChromeModa Solutions

Germany . 2,649 parts In-Stock

1+ parts

$7.948

100+ parts

$6.517

1k+ parts

-

10k+ parts

-

2,649

$7.948

$6.517

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-

IDEA Electronic Components Group

UK . 86 parts In-Stock

1+ parts

$7.948

100+ parts

-

1k+ parts

$7.153

10k+ parts

-

86

$7.948

-

$7.153

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AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$9.920

100+ parts

-

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811

$9.920

-

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Corphita

USA . 3,041 parts In-Stock

1+ parts

$18.351

100+ parts

-

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10k+ parts

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3,041

$18.351

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QUARKTWIN TECHNOLOGY LTD

USA . 25,493 parts In-Stock

1+ parts

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25,493

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Microchip USA

USA . 2,772 parts In-Stock

1+ parts

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2,772

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Kepictronics

USA . 32 parts In-Stock

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32

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Overview

Unlock the power of seamless communication with the TLK2501IRCPG4 by Texas Instruments. This innovative product is designed to deliver top-notch quality and reliability, coming from a trusted manufacturer in the industry. Ideal for various applications in the telecom interface ICs category, this product offers unparalleled value, benefits, and advantages to customers. Say goodbye to connectivity issues and experience smooth operations with the TLK2501IRCPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Power Supplies (V): 2.5

Operates at a low voltage to minimize power consumption and heat generation.

No. of Terminals: 64

Offers a high number of connection points for complex telecom applications, enabling versatile functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying conditions.

Minimum Operating Temperature: -40 °C

Functions reliably at low temperatures, ensuring stable performance in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for optimal signal transmission and longevity.

Width: 10 mm

Compact size allows for space-efficient integration into telecom systems, ideal for applications with limited board space.

Data Rate: 2500 Mbps

High data rate capability enables fast and efficient communication, essential for modern telecom networks.

Technical Specifications

Other Function Telecom Interface ICs TLK2501IRCPG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2500 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2501IRCPG4 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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