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TRF7970ARHB

Texas Instruments

TRF7970ARHB by Texas Instruments

TRF7970ARHB by Texas Instruments is a telecom IC with 32 terminals, CMOS technology, and 5V supply voltage. It operates b/w -40 to 110°C, suitable for industrial applications. The chip carrier package style with a very thin profile makes it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,772 parts In-Stock

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2,772

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Digiode

USA . 2,455 parts In-Stock

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2,455

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,929 parts In-Stock

1+ parts

$11.790

100+ parts

-

1k+ parts

$12.190

10k+ parts

-

1,929

$11.790

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$12.190

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ChromeModa Solutions

Germany . 6,894 parts In-Stock

1+ parts

$13.247

100+ parts

$10.863

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6,894

$13.247

$10.863

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IDEA Electronic Components Group

UK . 287 parts In-Stock

1+ parts

$13.247

100+ parts

$12.585

1k+ parts

$11.922

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287

$13.247

$12.585

$11.922

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AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$16.433

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279

$16.433

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One Stop Electronics

USA . 1,090 parts In-Stock

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$710.000

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1,090

$710.000

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DigiPath Technology Company

USA . 1,367 parts In-Stock

1+ parts

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$11.943

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1,367

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$11.943

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Perfect Parts

USA . 1,271 parts In-Stock

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1,271

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Corphita

USA . 1,017 parts In-Stock

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1,017

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Overview

Discover the cutting-edge TRF7970ARHB by Texas Instruments, a high-quality Other Function Telecom Interface IC designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. From its innovative technology to its industrial-grade temperature grade, the TRF7970ARHB delivers reliable performance in a compact chip carrier package. Experience seamless connectivity and efficiency with this top-of-the-line telecom circuit - the perfect solution for your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material provides protection for the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Operating Temperature: 110 °C

High operating temperature range ensures reliable performance in different environmental conditions.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation, enhancing overall performance.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power supply, making it easy to integrate into existing systems.

Technical Specifications

Other Function Telecom Interface ICs TRF7970ARHB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

TRF7970ARHB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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