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ADF7012BRUZ-REEL

Analog Devices

ADF7012BRUZ-REEL by Analog Devices

Analog Devices' ADF7012BRUZ-REEL is a telecom IC with 24 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 3V and matte tin terminal finish. This small outline IC is ideal for telecom interface applications requiring a compact design and industrial temperature grade reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,858 parts In-Stock

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4,858

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Digiode

USA . 655 parts In-Stock

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655

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Distributors (Availability)

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Native Components

USA . 608 parts In-Stock

1+ parts

$0.507

100+ parts

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608

$0.507

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Northwest PG Solutions

USA . 598 parts In-Stock

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$0.558

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$0.492

598

$0.558

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$0.492

Parana Technologies

USA . 4,585 parts In-Stock

1+ parts

$7.372

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$6.856

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4,585

$7.372

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$6.856

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

1+ parts

$7.927

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$7.531

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1,558

$7.927

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$7.531

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DigiPath Technology Company

USA . 690 parts In-Stock

1+ parts

$12.366

100+ parts

$11.871

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$11.871

690

$12.366

$11.871

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$11.871

AZTECH Wire

Italy . 768 parts In-Stock

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$19.314

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768

$19.314

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Semicontronic

India . 734 parts In-Stock

1+ parts

$347.000

100+ parts

$338.325

1k+ parts

$336.590

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734

$347.000

$338.325

$336.590

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One Stop Electronics

USA . 410 parts In-Stock

1+ parts

$570.000

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410

$570.000

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Ampacity Inc.

Singapore . 434 parts In-Stock

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$652.000

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434

$652.000

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Corphita

USA . 741 parts In-Stock

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741

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Overview

Unlock the power of seamless communication with the ADF7012BRUZ-REEL by Analog Devices, a top-tier manufacturer known for quality and innovation. This telecom interface IC offers unmatched reliability and performance in a compact package, making it ideal for a wide range of applications. From IoT devices to industrial automation, this product delivers value by ensuring smooth data transmission and connectivity. Stay ahead of the curve with the ADF7012BRUZ-REEL and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in production.

Package Shape: RECTANGULAR

Rectangular package shape is standard and fits well in most electronic devices, making it versatile for various applications.

No. of Terminals: 24

High number of terminals allows for more connectivity options and flexibility in designing circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with small outline and thin profile saves space on the PCB and enables a higher component density.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and conductivity for secure connections and efficient signal transmission.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves signal integrity, minimizing the risk of connection failures.

Maximum Seated Height: 1.2 mm

Low seated height saves space on the PCB and allows for compact design of electronic devices.

Width: 4.4 mm

Narrow width enables easy placement on the circuit board, facilitating efficient PCB layout and reducing component interference.

Length: 7.8 mm

Optimal length provides a balanced size for the component, ensuring compatibility with standard electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding industrial environments where temperature fluctuations are common.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical strength and heat dissipation, enhancing durability and performance of the component.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimized performance and compatibility with telecommunications systems.

Nominal Supply Voltage: 3 V

3V nominal supply voltage is compatible with standard electronic systems, making integration easy and straightforward.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB layouts and precise connections, enhancing the overall performance of the product.

Technical Specifications

Other Function Telecom Interface ICs ADF7012BRUZ-REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADF7012BRUZ-REEL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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