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ADF7030-1BCPZN-RL

Analog Devices

ADF7030-1BCPZN-RL by Analog Devices

Analog Devices ADF7030-1BCPZN-RL is a 40-terminal telecom IC with 3V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temp of 260°C. Suitable for telecom circuits, it comes in a square chip carrier package with very thin profile.

Median Price

$6.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,826 parts In-Stock

1+ parts

$6.410

100+ parts

$4.846

1k+ parts

$4.264

10k+ parts

-

1,826

$6.410

$4.846

$4.264

-

Analog Devices Inc

USA . 366 parts In-Stock

1+ parts

$6.410

100+ parts

$4.846

1k+ parts

$4.264

10k+ parts

$4.063

366

$6.410

$4.846

$4.264

$4.063

Mouser Electronics

USA . 2,493 parts In-Stock

1+ parts

$7.820

100+ parts

$4.860

1k+ parts

$3.950

10k+ parts

$3.940

2,493

$7.820

$4.860

$3.950

$3.940

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.900

2,500

-

-

-

$3.900

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$5.320

100+ parts

-

1k+ parts

-

10k+ parts

-

29

$5.320

-

-

-

Digiode

USA . 741 parts In-Stock

1+ parts

$7.106

100+ parts

-

1k+ parts

-

10k+ parts

-

741

$7.106

-

-

-

VNN

France . 1,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,713

-

-

-

-

Vyrian

USA . 1,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,087 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

2,087

$3.310

-

-

-

Semicontronic

India . 1,799 parts In-Stock

1+ parts

$3.310

100+ parts

$3.227

1k+ parts

$3.211

10k+ parts

-

1,799

$3.310

$3.227

$3.211

-

Continental Prestige Electronics

USA . 2,263 parts In-Stock

1+ parts

$5.320

100+ parts

-

1k+ parts

-

10k+ parts

$5.214

2,263

$5.320

-

-

$5.214

Corphita

USA . 67 parts In-Stock

1+ parts

$6.732

100+ parts

-

1k+ parts

-

10k+ parts

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67

$6.732

-

-

-

Corohmni

South Africa . 201 parts In-Stock

1+ parts

$8.165

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$8.165

-

-

-

Parana Technologies

USA . 337 parts In-Stock

1+ parts

$10.671

100+ parts

-

1k+ parts

$9.924

10k+ parts

-

337

$10.671

-

$9.924

-

IDEA Electronic Components Group

UK . 1,030 parts In-Stock

1+ parts

$11.474

100+ parts

$10.900

1k+ parts

$10.900

10k+ parts

-

1,030

$11.474

$10.900

$10.900

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$15.765

100+ parts

$14.346

1k+ parts

$12.927

10k+ parts

-

600

$15.765

$14.346

$12.927

-

DigiPath Technology Company

USA . 1,294 parts In-Stock

1+ parts

$17.899

100+ parts

$17.183

1k+ parts

-

10k+ parts

$17.183

1,294

$17.899

$17.183

-

$17.183

Authorized Procurement Solutions

USA . 125,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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125,000

-

-

-

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Argo Parts USA

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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358

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-

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-

Overview

Elevate your telecom interface IC experience with the ADF7030-1BCPZN-RL by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge technology in a compact SQUARE package. With 40 terminals and a temperature range from -40 to 85° °C, this chip carrier is perfect for industrial applications. Say goodbye to lead terminals and hello to a seamless integration process with a 3V supply voltage. Experience the value and benefits of this Telecom Circuit IC, offering unparalleled performance and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easier to integrate into electronic devices and reduce manual labor during assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board.

No. of Terminals: 40

Having a high number of terminals allows for more connectivity options and flexibility in designing circuits.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer improved thermal management and compact design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in a variety of climates and conditions.

Terminal Position: QUAD

Quad terminal position offers increased stability and connectivity.

Maximum Seated Height: 0.8 mm

Low maximum seated height helps in achieving a slim profile for the overall device.

Width: 6 mm

Compact width makes it suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces the risk of component damage during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component bonding.

Length: 6 mm

Compact length complements the overall compact design of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in industrial environments.

Terminal Form: NO LEAD

No-lead terminal form improves solder joint quality and reliability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, offering optimized performance in telecommunications applications.

Nominal Supply Voltage: 3 V

3V supply voltage is commonly used in electronic devices, making it compatible with a wide range of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures that the product can withstand moderate exposure to moisture during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs ADF7030-1BCPZN-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

ADF7030-1BCPZN-RL Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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