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XCC2564MODNCMOET

Texas Instruments

XCC2564MODNCMOET by Texas Instruments

Texas Instruments XCC2564MODNCMOET is a 33-terminal SQUARE CHIP CARRIER IC with operating temperatures from -20 to 70°C. It's a TELECOM CIRCUIT suitable for telecom interfaces, featuring a nominal voltage of 3.6V and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,919 parts In-Stock

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Digiode

USA . 4,945 parts In-Stock

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PC Components Company LLC

USA . 500 parts In-Stock

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500

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Bristol Electronics

USA . 500 parts In-Stock

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500

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Corohmni

South Africa . 140 parts In-Stock

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$8.718

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$8.718

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Parana Technologies

USA . 1,546 parts In-Stock

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$12.286

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$12.715

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DigiPath Technology Company

USA . 148 parts In-Stock

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$13.528

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$13.528

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ChromeModa Solutions

Germany . 6,169 parts In-Stock

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$13.804

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$11.319

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IDEA Electronic Components Group

UK . 943 parts In-Stock

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$13.804

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$13.114

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$12.424

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943

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AZTECH Wire

Italy . 518 parts In-Stock

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$14.076

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Semicontronic

India . 168 parts In-Stock

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$379.000

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$369.525

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$367.630

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Ampacity Inc.

Singapore . 1,023 parts In-Stock

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$384.000

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One Stop Electronics

USA . 329 parts In-Stock

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$856.000

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Argo Parts USA

USA . 2,384 parts In-Stock

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Corphita

USA . 2,366 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,124 parts In-Stock

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Perfect Parts

USA . 456 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your telecommunications projects with the XCC2564MODNCMOET by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions that meet industry standards. This telecom interface IC is versatile and efficient, making it ideal for a wide range of applications. From data transmission to network connectivity, this product offers exceptional value and performance. Upgrade your systems today with the XCC2564MODNCMOET and experience the benefits of superior technology.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square shape allows for efficient use of board space and can lead to better thermal performance.

No. of Terminals: 33

Provides a sufficient number of terminals for connectivity and functionality in telecom applications.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good protection for the IC and ensures reliability in various operating conditions.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures without compromising performance, suitable for telecom applications.

Minimum Operating Temperature: -20 °C

Capable of functioning in cold environments, providing versatility for different operating conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connection to the circuit board.

Maximum Seated Height: 1.4 mm

Low profile design with a maximum seated height of 1.4 mm can help with space-constrained layouts.

Width: 7 mm

Compact width allows for efficient placement on the board and can contribute to overall system miniaturization.

Length: 7 mm

Square shape design with a length of 7 mm optimizes board space utilization.

Terminal Form: BUTT

Butt terminal form ensures secure electrical connections and reliable performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and performance in telecommunication systems.

Nominal Supply Voltage: 3.6 V

Operates at a nominal supply voltage of 3.6 V, suitable for telecom applications and compatible with standard power sources.

Technical Specifications

Other Function Telecom Interface ICs XCC2564MODNCMOET attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XBCC-B33

Length:

7 mm

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

BCC

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

XCC2564MODNCMOET Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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