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AX-SFEU-API-1-01-TB05

Onsemi

AX-SFEU-API-1-01-TB05 by Onsemi

AX-SFEU-API-1-01-TB05 by Onsemi is a Telecom Interface IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. Features Ni/Pd/Au terminal finish, 3V supply voltage, and 0.5mm terminal pitch for telecom circuit applications.

Median Price

$2.425

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$1.778

100+ parts

-

1k+ parts

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10k+ parts

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1

$1.778

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Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$2.770

100+ parts

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1

$2.770

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Mouser Electronics

USA . 107 parts In-Stock

1+ parts

$3.710

100+ parts

$2.790

1k+ parts

$2.180

10k+ parts

$2.070

107

$3.710

$2.790

$2.180

$2.070

Rochester

USA . 98 parts In-Stock

1+ parts

-

100+ parts

$2.080

1k+ parts

$1.860

10k+ parts

$1.750

98

-

$2.080

$1.860

$1.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,171 parts In-Stock

1+ parts

$1.689

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2,171

$1.689

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Vyrian

USA . 3,296 parts In-Stock

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3,296

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ACDS - Activité Composants Distribution Service

France . 465 parts In-Stock

1+ parts

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465

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Bristol Electronics

USA . 465 parts In-Stock

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465

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Dan-Mar Components

USA . 465 parts In-Stock

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465

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Goldney Electronics S.L.

Spain . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 547 parts In-Stock

1+ parts

$1.600

100+ parts

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547

$1.600

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Corohmni

South Africa . 381 parts In-Stock

1+ parts

$1.778

100+ parts

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381

$1.778

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QUARKTWIN TECHNOLOGY LTD

USA . 8,848 parts In-Stock

1+ parts

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8,848

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Kulean Microsystems

USA . 7,595 parts In-Stock

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7,595

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SupplyDigital Components

Austria . 5,442 parts In-Stock

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5,442

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Northwest PG Solutions

USA . 2,331 parts In-Stock

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2,331

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Problanco Electronics

Mexico . 1,972 parts In-Stock

1+ parts

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1,972

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TANS Electronics

Latvia . 1,600 parts In-Stock

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1,600

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Native Components

USA . 440 parts In-Stock

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440

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UHIMA Technologies

Türkiye . 439 parts In-Stock

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439

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FE SAS

France . 30 parts In-Stock

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30

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Overview

Unlock the potential of your telecom devices with the AX-SFEU-API-1-01-TB05 by Onsemi. Manufactured with precision and expertise, this cutting-edge product offers unmatched quality and reliability in the world of Other Function Telecom Interface ICs. Perfect for a wide range of applications, this product is designed to enhance performance and efficiency, providing customers with unparalleled value and benefits. Experience seamless connectivity and superior functionality with the AX-SFEU-API-1-01-TB05 by Onsemi - the ultimate solution for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to external elements, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto a PCB, saving time and cost during production.

Package Shape: RECTANGULAR

Rectangular shape provides a compact size that saves space on the PCB, ideal for applications with limited room for components.

No. of Terminals: 40

Having 40 terminals allows for a higher level of connectivity and functionality, making the product versatile in various telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combination offers efficient heat dissipation, compact size, and improved performance, making it suitable for demanding telecom environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising functionality, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments, expanding its usability across a wide range of temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring stable and reliable connections for the product.

Terminal Position: QUAD

Quad terminal position offers improved connectivity and efficient signal transmission, enhancing the overall performance of the product in telecom applications.

Maximum Seated Height: 1 mm

Low maximum seated height enables a slim and compact design, making the product suitable for space-constrained telecom devices.

Width: 5 mm

Narrow width allows for placement in tight spaces on a PCB, enabling efficient use of board real estate in telecom equipment.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering during assembly, contributing to the product's quality and reliability.

Length: 7 mm

Short length contributes to the overall compactness of the product, making it suitable for small form factor telecom devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions commonly found in telecom environments, making the product robust and durable.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and promotes eco-friendly manufacturing processes, aligning with sustainability initiatives.

Telecom IC Type: TELECOM CIRCUIT

Specialized for telecom applications, the telecom IC type ensures optimized performance and compatibility with telecom systems, making it a reliable choice for telecom equipment designs.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V meets standard requirements for telecom applications, ensuring compatibility and proper operation within telecom systems.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, the product offers high-density packaging and efficient use of board space, enabling compact and high-performance telecom device designs.

Technical Specifications

Other Function Telecom Interface ICs AX-SFEU-API-1-01-TB05 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

AX-SFEU-API-1-01-TB05 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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