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MRF24WG0MBRT-I/RM110

Microchip Technology

MRF24WG0MBRT-I/RM110 by Microchip Technology

MRF24WG0MBRT-I/RM110 by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape, 36 terminals, and operates in temperatures ranging from -40 to 85 °C. This IC is commonly used in industrial applications requiring a nominal voltage of 3.3 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 400 parts In-Stock

1+ parts

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100+ parts

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400

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 304 parts In-Stock

1+ parts

$10.048

100+ parts

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304

$10.048

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Aztec Data Supply Inc.

USA . 4,779 parts In-Stock

1+ parts

$13.380

100+ parts

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4,779

$13.380

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$13.622

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621

$13.622

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Ampacity Inc.

Singapore . 405 parts In-Stock

1+ parts

$64.000

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405

$64.000

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Continental Prestige Electronics

USA . 5,074 parts In-Stock

1+ parts

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5,074

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Argo Parts USA

USA . 2,029 parts In-Stock

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2,029

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RGB Technical Solutions

Ukraine . 876 parts In-Stock

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876

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience seamless connectivity and unlock endless possibilities with the MRF24WG0MBRT-I/RM110 by Microchip Technology. As a leader in telecom interface ICs, Microchip Technology ensures top-notch quality and reliability in every product. Whether you're in the telecommunications industry or looking to enhance your IoT devices, this versatile module will exceed your expectations. With its compact design and wide temperature range, it seamlessly integrates into any system. Stay connected, stay ahead with Microchip Technology.

Feature Benefit Bullets

No. of Functions: 1

Having a single function simplifies the design and reduces complexity, making this product easier to integrate into telecom systems.

Screening Level: TS 16949

This high-quality screening level ensures reliability and compliance with industry standards, making it a reliable choice for telecom applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, enabling compact designs and saving valuable real estate in telecom devices.

No. of Terminals: 36

With 36 terminals, this product provides a sufficient number of connections for various telecom interface requirements, enhancing versatility and compatibility.

Package Style: MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style offers improved precision, stability, and performance, making it an optimal choice for telecom interface ICs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable operation, even in demanding telecom environments, increasing performance and longevity.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand extreme cold conditions, ensuring optimum functionality in diverse telecom applications.

Terminal Position: DUAL

The dual terminal position facilitates easy connection and promotes efficient signal flow, contributing to seamless integration into telecom systems.

Maximum Seated Height: 2.7 mm

With a low maximum seated height, this product allows for low-profile designs and efficient stacking of components, providing flexibility in telecom product designs.

Width: 21 mm

The compact width of 21 mm enables space-saving integration, allowing for more efficient utilization of limited resources in telecom devices.

Length: 31 mm

The moderate length of 31 mm strikes a balance between compactness and functionality, enabling easy integration and suitable compatibility with telecom equipment.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature conditions, this product can operate reliably in a wide range of temperatures, ensuring robust performance in telecom applications.

Terminal Form: NO LEAD

The no-lead terminal form offers advantages such as improved solderability, reduced risk of short circuits, and enhanced reliability, making it an ideal choice for telecom systems.

Telecom IC Type: TELECOM CIRCUIT

With a dedicated telecom circuit type, this product is specifically designed to meet the demanding requirements and stringent standards of telecom applications.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage falls within commonly used voltage ranges in telecom systems, ensuring seamless integration and compatibility.

Technical Specifications

Other Function Telecom Interface ICs MRF24WG0MBRT-I/RM110 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-XDMA-N36

Length:

31 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.7 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

21 mm

Trade Compliance

MRF24WG0MBRT-I/RM110 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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