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MRF24J40-I/ML

Microchip Technology

MRF24J40-I/ML by Microchip Technology

MRF24J40-I/ML by Microchip: 3.3V supply, -40 to 85°C temp range, quad terminal position. Telecom circuit IC for industrial applications in plastic/epoxy package with matte tin finish and 40 terminals.

Median Price

$3.760

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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RS (Exports)

UK . 56 parts In-Stock

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$1.080

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RS Americas

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$2.610

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Element14

Singapore . 450 parts In-Stock

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$3.580

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$3.580

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Newark

USA . 340 parts In-Stock

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$3.760

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$3.670

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$3.640

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Mouser Electronics

USA . 3,728 parts In-Stock

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$4.010

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$3.530

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Microchip Technology

USA . 5,014 parts In-Stock

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$4.240

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$3.100

DigiKey

USA . 980 parts In-Stock

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$4.240

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$3.530

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Master Electronics

USA . 244 parts In-Stock

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$3.230

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$3.070

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$3.020

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Verical

USA . 244 parts In-Stock

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$4.053

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$3.896

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$4.215

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NAC Semi

USA . 4,026 parts In-Stock

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$4.910

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$4.450

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$4.070

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Bristol Electronics

USA . 120 parts In-Stock

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$6.326

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$2.741

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Vyrian

USA . 1,152 parts In-Stock

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Chip Stock

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IBS Electronics

USA . 244 parts In-Stock

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$5.722

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$5.582

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Dan-Mar Components

USA . 120 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 95 parts In-Stock

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Semi Source

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,066 parts In-Stock

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$2.220

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$2.220

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Semicontronic

India . 919 parts In-Stock

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$2.220

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$2.164

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$2.153

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919

$2.220

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$2.153

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Continental Prestige Electronics

USA . 574 parts In-Stock

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$4.215

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$4.131

574

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Argo Parts USA

USA . 175 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$4.131

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Andel Nordic

Denmark . 5,438 parts In-Stock

1+ parts

$4.661

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$4.475

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$4.475

5,438

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$4.475

Allen Electronics Distributors

USA . 56 parts In-Stock

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$6.940

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$5.120

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Corohmni

South Africa . 724 parts In-Stock

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Aztec Data Supply Inc.

USA . 450 parts In-Stock

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$8.554

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LOOK Integrated Logistics

Peru . 8,008 parts In-Stock

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NIA Electronics

USA . 6,519 parts In-Stock

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Ledger Components

France . 6,519 parts In-Stock

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Montano Global Distributors

Canada . 5,125 parts In-Stock

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Lixinc

USA . 4,163 parts In-Stock

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Perfect Parts

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LMD Electronica

Estonia . 2,043 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,548 parts In-Stock

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Futuretech Components

Singapore . 90 parts In-Stock

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Overview

Experience cutting-edge technology with the MRF24J40-I/ML by Microchip Technology. Known for their high-quality products, Microchip Technology has once again delivered a top-notch telecom interface IC that is perfect for a wide range of applications. With its compact package style and industrial-grade temperature grade, this chip carrier offers exceptional performance and reliability. Say goodbye to connectivity issues and hello to seamless operations with the MRF24J40-I/ML. Upgrade your systems today and enjoy the benefits of superior quality and innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making it ideal for portable or handheld devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly processes, saving time and cost.

Package Shape: SQUARE

Square package shape provides efficient use of space on PCBs, maximizing component density.

Power Supplies (V): 3.3

Operates at a commonly used voltage level, ensuring compatibility with existing systems.

No. of Terminals: 40

Having a high number of terminals allows for more connectivity options and features in the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and assembly, catering to different product requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments without issues.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the product's lifespan.

Terminal Position: QUAD

Quad terminal position allows for better signal integrity and easier PCB layout.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB and enables thinner product designs.

Width: 6 mm

Compact width dimensions enable the integration of the product into space-constrained devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints during assembly processes.

Length: 6 mm

Short length dimensions contribute to overall compactness and efficient use of board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade allows for operation in harsh industrial environments without performance degradation.

Terminal Form: NO LEAD

Lead-free terminal form adheres to environmental regulations and ensures product safety.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in telecommunications systems.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V facilitates compatibility with standard power supplies and devices.

Terminal Pitch: 0.5 mm

Narrow terminal pitch enables high-density mounting, allowing for more features in a compact form factor.

Technical Specifications

Other Function Telecom Interface ICs MRF24J40-I/ML attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

MRF24J40-I/ML Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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