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HTRC11001T/02EE

NXP Semiconductors

HTRC11001T/02EE by NXP Semiconductors

NXP Semiconductors' HTRC11001T/02EE is a telecom interface IC with 14 terminals, operating at 5V. It features a small outline package style, industrial temperature grade, and nickel palladium gold terminal finish. Ideal for telecom circuits, this IC has a max seated height of 1.75mm and operates b/w -40 to 85°C.

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Digiode

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Anansix

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Vyrian

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Nova Conductors

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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LIBRA Elektronik GmbH

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Aztec Data Supply Inc.

USA . 2,670 parts In-Stock

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$14.280

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Corohmni

South Africa . 245 parts In-Stock

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AZTECH Wire

Italy . 650 parts In-Stock

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Advanced Electronics

New Zealand . 33 parts In-Stock

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Ampacity Inc.

Singapore . 1,517 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,028 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Overview

Unleash the power of cutting-edge telecom technology with the HTRC11001T/02EE by NXP Semiconductors. Crafted with precision and expertise, this telecom interface IC offers unparalleled performance and reliability for a wide range of applications. Whether you're designing communication systems or networking equipment, this product is guaranteed to deliver exceptional value and benefits. Experience seamless connectivity and superior functionality with the HTRC11001T/02EE - the ultimate solution for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers a good balance of durability and cost-effectiveness, making this product a reliable and affordable choice.

Surface Mount: YES

Being surface mountable allows for easy integration into PCBs, simplifying assembly and reducing overall manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that is easy to work with and fits well in typical electronic designs.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes this product compatible with a wide range of systems and applications.

No. of Terminals: 14

Having 14 terminals allows for more connectivity options and flexibility in designing complex telecom interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs where size constraints are a concern.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can also function effectively in harsh cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and longevity, ensuring stable connections over time.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and options for different connection configurations, enhancing the product's versatility.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile and minimal obstruction on the PCB, contributing to a more compact and efficient design.

Width: 3.9 mm

The narrow width enables the product to fit into confined spaces and tight layouts, making it suitable for applications with space constraints.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of thermal damage during the manufacturing process, ensuring product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly, ensuring strong and durable connections in the final product.

Length: 8.65 mm

The compact length of the product contributes to a space-saving design without compromising on functionality or performance.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is suitable for use in rugged and demanding environments where temperature fluctuations are common.

Terminal Form: GULL WING

The gull wing terminal form provides reliable mechanical strength and easier soldering, ensuring secure and stable connections in various applications.

Maximum Supply Current: 0.01 mA

The low maximum supply current consumption makes this product energy-efficient, benefiting battery-powered devices and minimizing power costs.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC, this product offers optimized performance and features tailored for telecommunications applications.

Nominal Supply Voltage: 5 V

Operating at a standard 5V nominal supply voltage simplifies compatibility and integration with other components in the system, reducing design complexity.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for dense packing of terminals on the PCB, maximizing signal routing options and enabling high-performance connectivity.

Technical Specifications

Other Function Telecom Interface ICs HTRC11001T/02EE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.01 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HTRC11001T/02EE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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