Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors' HTRC11001T/02EE is a telecom interface IC with 14 terminals, operating at 5V. It features a small outline package style, industrial temperature grade, and nickel palladium gold terminal finish. Ideal for telecom circuits, this IC has a max seated height of 1.75mm and operates b/w -40 to 85°C.
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The plastic/epoxy body material offers a good balance of durability and cost-effectiveness, making this product a reliable and affordable choice.
Being surface mountable allows for easy integration into PCBs, simplifying assembly and reducing overall manufacturing costs.
The rectangular package shape provides a standardized form factor that is easy to work with and fits well in typical electronic designs.
Operating at a standard 5V power supply voltage makes this product compatible with a wide range of systems and applications.
Having 14 terminals allows for more connectivity options and flexibility in designing complex telecom interfaces.
The small outline package style saves space on the PCB, making it ideal for compact designs where size constraints are a concern.
The high maximum operating temperature range ensures reliable performance even in demanding industrial environments with elevated temperatures.
With a low minimum operating temperature, this product can also function effectively in harsh cold conditions without any issues.
The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and longevity, ensuring stable connections over time.
Having dual terminal positions provides redundancy and options for different connection configurations, enhancing the product's versatility.
The low maximum seated height allows for a slim profile and minimal obstruction on the PCB, contributing to a more compact and efficient design.
The narrow width enables the product to fit into confined spaces and tight layouts, making it suitable for applications with space constraints.
The short maximum time at peak reflow temperature minimizes the risk of thermal damage during the manufacturing process, ensuring product integrity.
The high peak reflow temperature allows for reliable soldering during assembly, ensuring strong and durable connections in the final product.
The compact length of the product contributes to a space-saving design without compromising on functionality or performance.
Designed for industrial temperature ranges, this product is suitable for use in rugged and demanding environments where temperature fluctuations are common.
The gull wing terminal form provides reliable mechanical strength and easier soldering, ensuring secure and stable connections in various applications.
The low maximum supply current consumption makes this product energy-efficient, benefiting battery-powered devices and minimizing power costs.
Being specifically designed as a telecom circuit IC, this product offers optimized performance and features tailored for telecommunications applications.
Operating at a standard 5V nominal supply voltage simplifies compatibility and integration with other components in the system, reducing design complexity.
The small terminal pitch allows for dense packing of terminals on the PCB, maximizing signal routing options and enabling high-performance connectivity.
Other Function Telecom Interface ICs HTRC11001T/02EE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
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Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
HTRC11001T/02EE Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
STMicroelectronics
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
450-0177C
Ls Research
TELECOM CIRCUIT;
CLRC66301HN
CLRC66301HN by NXP Semiconductors is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. It has a nominal voltage of 5V and terminal pitch of 0.5mm. This chip carrier is used in telecom circuits for various applications due to its compact size and surface-mount capability.
CYBLE-022001-00
Cypress Semiconductor
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
TUSB211IRWBR
TUSB211IRWBR by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 85 °C. It features a 12-terminal chip carrier package suitable for industrial applications requiring a 3.3 V supply voltage and low current consumption of 0.02 mA.
ESP32-D0WDQ6
Espressif Systems (Shanghai)
ESP32-D0WDQ6 by Espressif Systems (Shanghai) is a 48-terminal IC with CMOS technology, operating at -40 to 125 °C. It has a nominal voltage of 3.3 V and is suitable for automotive telecom circuits due to its compact square chip carrier package style.
CYBT-353027-02
Infineon Technologies
Infineon's CYBT-353027-02 is a square-shaped, surface-mountable telecom IC with 19 terminals. Operating b/w -30°C to 85°C, it has a seated height of 1.75mm and terminal pitch of 1.05mm. Ideal for telecom circuits, this microelectronic assembly is suitable for various applications requiring compact design and reliable performance.
HMC773ALC3BTR-R5
Analog Devices
Analog Devices' HMC773ALC3BTR-R5 is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. With a very thin profile and no-lead terminal form, it's ideal for telecom interface applications.
CC2592RGVT
CC2592RGVT by Texas Instruments is a Telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3V and terminal pitch of 0.65mm, it is ideal for telecom circuit interfaces requiring surface mount technology.
NEO-6M-0-001
U-blox Ag
MAYA-W160-00B
AD9874ABST
AD9874ABST by Analog Devices is a telecom interface IC with 48 terminals in a square package. It operates at -40 to 85°C, with power supplies of 3/3.3V and 3/5V. This BICMOS technology IC is ideal for telecom circuits requiring low profile, fine pitch components.
EFR32BG22C224F512GN32-C
Silicon Labs
TELECOM CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
WL1801MODGBMOCR
WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.
MAX2769CETI+T
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
XB3-24Z8PT
Digi International
The Digi International XB3-24Z8PT is a telecom IC with 20 terminals in a MICROELECTRONIC ASSEMBLY package. It operates in temperatures ranging from -40°C to 85°C, making it suitable for industrial applications requiring reliable telecom circuit connections. The terminal form is THROUGH-HOLE, ideal for robust and secure installations.
TLK2711IRCPG4
TLK2711IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 2.5V and peak reflow temp of 260°C. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form.
MAX-8Q-0-10
The U-blox Ag MAX-8Q-0-10 is a surface mount telecom IC with 18 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3V. With a compact size (9.7mm x 10.1mm), it's ideal for applications requiring telecom circuit functionality in tight spaces.
TM1062DSB2
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
SA606DK/01,112
SA606DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and Gull Wing form factor.
CC2564CRVMT
Texas Instruments CC2564CRVMT is a telecom IC with 76 terminals in a square chip carrier package. It operates at -40 to 85°C, with a data rate of 4 Mbps and nominal voltage of 3.6 V. Ideal for telecom applications requiring high-speed data transmission in industrial environments.
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HTRC11001T/02EE,11
NXP Semiconductors' HTRC11001T/02EE,11 is a telecom interface IC with 14 terminals and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial applications. The package style is small outline, surface mountable, with nickel palladium gold finish.
HTRC11001T/03EE,11
The NXP Semiconductors HTRC11001T/03EE,11 is a telecom interface IC with 1 function and 14 terminals. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 5V. This small outline package is suitable for industrial applications requiring reliable telecom circuitry.
HTRC11001T/03EE
NXP Semiconductors' HTRC11001T/03EE is a telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and current of 0.01mA, suitable for industrial applications. The package is small outline, rectangular in shape, with gull wing terminals for surface mount assembly.
HTRC11001T
Philips Semiconductors
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
The NXP Semiconductors HTRC11001T is a telecom interface IC with 14 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and max current of 0.01mA, suitable for industrial applications requiring a small outline package style. The IC features nickel palladium gold terminal finish and gull wing form factor for surface mount assembly.
HTRC12002B
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Package Equivalence Code: QFP32,.35SQ,32;
HTRC12002B/03D
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
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